MAX 77836 Mobile Phone IC

Efficient and Advanced Power Management

The MAX 77836 Mobile Phone IC is engineered to provide exceptional power management for modern mobile devices. Its state-of-the-art functionality ensures prolonged battery life while optimizing performance—making it the ideal choice for smartphones and portable gadgets. MAX 77836 Mobile Phone IC

Compact Design with High Performance

Designed to integrate seamlessly into compact devices, the MAX 77836 excels in delivering efficient energy regulation without compromising on space. Its robust architecture supports multiple functionalities, ensuring stability and efficiency under diverse operating conditions. MAX 77836 Mobile Phone IC

Reliable for Cutting-Edge Applications

Whether you are upgrading an existing setup or working on innovative mobile technologies, the MAX 77836 Mobile Phone IC meets the demands of the modern tech industry. Count on its precision and durability to power the future of mobile innovation. MAX 77836 Mobile Phone IC

The MAX77836 is a high-performance sub-Power Management Integrated Circuit (PMIC) designed specifically for mobile and wearable devices. It is famously utilized in various Samsung Galaxy series smartphones (like the S7 and S4) and wearable products. MAX 77836 Mobile Phone IC

This IC is a multi-functional component, combining a Micro-USB Interface Circuit (MUIC), a Li+ battery charger, a ModelGauge™ fuel gauge, and dual low-dropout (LDO) regulators.

Technical Specifications Table

Feature Category	Specification / Detail
Core Functions	MUIC-USB Interface, Li+ Charger, Fuel Gauge, Dual LDOs
Input Voltage Range	2.5V to 11.0V (VBUS)
Battery Voltage Range	Support for 1-cell Li-ion (up to 4.5V)
Charging Algorithm	Intelligent Constant Current/Constant Voltage (CC/CV)
Fuel Gauge Tech	ModelGauge™ (MG1) (No sense resistor required)
LDO Outputs	2x Linear Regulators (LDO1, LDO2)
Interface Support	USB 2.0 Hi-Speed, UART, Stereo Audio (Negative Rail)
USB Standards	USB Battery Charging Revision 1.2 compliant
Communication	$I^2C$ Serial Interface (Standard/Fast Mode)
Standby Current	~4µA (Hibernate mode)
Package Type	72-bump WLP (Wafer-Level Package)
Package Dimensions	~3.85mm x 3.52mm (WLP 8×9)
Operating Temp	-40°C to +85°C

Detailed Feature Breakdown

1. MUIC (Micro-USB Interface Circuit)

The MAX77836 serves as the primary gateway for the Micro-USB port. It features an intelligent detection block that identifies various cable types, including:

Standard USB 2.0 Hi-Speed data cables.
UART (Universal Asynchronous Receiver/Transmitter) for debugging.
Stereo audio signals (supporting negative rail operation down to -2V for high-fidelity audio).
Proprietary and standard chargers (USB BC1.2).

2. Li-Ion Battery Charger

The integrated charger is designed for efficiency and safety. It includes reverse blocking capability to prevent battery discharge when no power source is present.

Thermal Regulation: Automatically adjusts charging current to prevent the IC from overheating.
Safety Timers: Protects the battery from overcharging.

3. ModelGauge™ Fuel Gauge

Unlike traditional fuel gauges that require a precision sense resistor (which consumes space and power), the MAX77836 uses the ModelGauge™ algorithm. It calculates the State of Charge (SOC) based on voltage tracking and battery modeling, providing high accuracy even with varying temperatures and discharge rates.

4. Power Rails (LDOs)

The chip provides two internal linear regulators. These are typically used to power sensitive analog components or low-power peripherals in the phone that require a “clean” voltage supply with minimal noise.

5. Mechanical and Thermal Specs

The IC is built on the S18 process with approximately 204,265 transistors. Its WLP packaging is optimized for the tight PCB (Printed Circuit Board) layouts found in modern smartphones.

Applications in Mobile Repairing

The MAX77836 is often a point of failure in phones that:

Refuse to charge or show a “charging paused” error.
Have incorrect battery percentage readings.
Experience “no power” issues despite a healthy battery.
Fail to connect to a PC via USB.

When replacing this IC, technicians typically use a BGA reballing stencil specifically for the 72-bump configuration and apply heat at approximately 330°C to 350°C depending on the lead/lead-free solder profile used.

MAX 77836 Mobile Phone IC