HI 1102 Mobile Phone IC
Efficient Performance in a Compact Design
The HI 1102 Mobile Phone IC is engineered to deliver unparalleled efficiency, ensuring your mobile device performs at its peak. Designed for adaptability, this IC powers seamless multitasking and enhanced functionality in modern smartphones. HI 1102 Mobile Phone IC
Durable and Reliable Technology
Built to last, the HI 1102 promises reliability without compromise. Its advanced construction minimizes power consumption while maintaining optimal performance, making it the ideal choice for a wide range of smartphone models. HI 1102 Mobile Phone IC
Perfect for Advanced Mobile Applications
The HI 1102 IC is equipped to support cutting-edge mobile technologies, keeping your device future-proof. Whether it’s high-speed data processing or enhanced connectivity, this IC meets the demands of the latest innovations in mobile communications.
The HiSilicon HI1102 (often stylized as Hi1102) is a highly integrated, high-performance “five-in-one” connectivity chip primarily developed for Huawei and Honor mobile devices. It serves as the central hub for wireless communication, handling Wi-Fi, Bluetooth, GNSS (GPS), FM Radio, and Infrared (IR). HI 1102 Mobile Phone IC
Because it is a proprietary chip, detailed public datasheets are rare, but the following specifications represent the standard technical data for the most common version, the Hi1102A/V120. HI 1102 Mobile Phone IC
HI1102 IC Technical Specifications
| Feature Category | Detail / Specification |
| Manufacturer | HiSilicon (Huawei Technologies Co., Ltd.) |
| IC Type | 5-in-1 Wireless Connectivity Combo Chip |
| Common Model Numbers | HI1102, HI1102A, HI1102V100, HI1102V120 |
| Integrated Modules | Wi-Fi, Bluetooth, GNSS (GPS), FM, IR |
| Packaging | FCCSP (Flip-Chip Chip Scale Package) |
| Pin Count | 143 Pins |
| Package Dimensions | 5.8 mm x 5.1 mm x 0.786 mm |
| Operating Temperature | –30°C to +85°C |
| Power Supply (V_BAT) | 2.8V – 4.5V |
| Digital I/O Voltage | 1.8V |
| Front-End Module (FEM) I/O | 3.3V |
Component Breakdown
1. Wi-Fi Module
The HI1102 is primarily a Wi-Fi 5 (802.11ac) solution. It is designed to work efficiently with the Kirin processor series to provide high-speed internet with low power consumption. HI 1102 Mobile Phone IC
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Protocols: IEEE 802.11 a/b/g/n/ac
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Bands: Dual-band (2.4 GHz and 5 GHz)
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MIMO Support: 1×1 SISO (Single-Input Single-Output)
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Bandwidth: Supports up to 80 MHz channel width
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Max Physical Rate: 433 Mbps
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Special Features: Supports Narrowband Wi-Fi (<1 MHz or 10 MHz), which is utilized in specialized hardware like drones for ultra-long-distance image transmission. HI 1102 Mobile Phone IC
2. Bluetooth Module
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Version: Bluetooth 5.1 (some early versions like V100 supported 4.1/4.2)
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Features: BLE (Bluetooth Low Energy) support, high-speed data transfer, and improved coexistence with Wi-Fi signals to prevent interference. HI 1102 Mobile Phone IC
3. GNSS (Navigation)
The chip handles multi-constellation satellite positioning, ensuring the device can lock onto signals globally. HI 1102 Mobile Phone IC
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Supported Systems: GPS L1, GLONASS, BDS-3 (Beidou), Galileo E1, QZSS
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High-Precision: Supports RTK (Real-Time Kinematic) for L1 frequencies in some revisions. HI 1102 Mobile Phone IC
4. Data Interfaces
The IC communicates with the main mobile processor (CPU) via several standardized high-speed interfaces:
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Wi-Fi Interface: SDIO (Secure Digital Input Output) with speeds up to 320 Mbps.
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BT/GNSS Interface: UART (Universal Asynchronous Receiver-Transmitter).
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Audio (BT/FM): PCM / I2S interfaces for digital audio routing.
Application and Compatibility
The HI1102 is the “go-to” replacement part for a wide range of Huawei and Honor smartphones from the mid-2010s to the early 2020s. It is often found in devices powered by Kirin 650, 655, 659, 970, and 980 chipsets.
Frequently Supported Devices:
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Huawei P-Series: P8 Lite, P9, P20 Pro, P30, P40 Pro, P50 (select regions).
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Huawei Mate Series: Mate 8, Mate 10, Mate 20.
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Honor Series: Honor 4X, 4C, 5A, 5C, 6X, 7X, 8 Lite, 8X, 9 Lite.
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Nova Series: Nova 3, Nova 3i.
Troubleshooting & Common Failures
When this IC fails, the phone usually loses all wireless capabilities simultaneously. Common symptoms include:
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Greyed-out Wi-Fi: The Wi-Fi toggle in settings cannot be turned on.
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Bluetooth Failure: The device cannot discover or pair with any Bluetooth accessories.
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GPS Inaccuracy: The phone struggles to find a location or “drifts” significantly.
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FM Radio issues: Total lack of signal even with headphones plugged in (acting as an antenna).
Note for Technicians: The V120 version of the HI1102 is generally considered superior for repairs as it offers better thermal stability compared to the older V100. When replacing this chip, a hot air rework station is required, typically set between 260°C and 300°C depending on the lead-free solder used on the motherboard.
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