WCN 3980 Mobile Phone IC
Enhanced Mobile Communication Efficiency
The WCN 3980 Mobile Phone IC is engineered with cutting-edge technology to optimize mobile communication. This integrated circuit is designed for seamless performance, offering exceptional reliability, low power consumption, and compact build for integration into modern mobile devices. With its ability to streamline connectivity, the WCN 3980 stands out as a crucial component in mobile hardware innovation. WCN 3980 Mobile Phone IC
Advanced Features for Connectivity Excellence
Built to meet the demands of next-gen devices, the WCN 3980 integrates advanced functionality to ensure smooth connectivity. It supports multiple communication protocols, enabling flawless data transmission and reception. Its low-latency design ensures exceptional user experience, ideal for voice calls, video streaming, and mobile app usage. Additionally, the IC’s energy-efficient architecture contributes to extended battery life, making it an optimal choice for mobile device manufacturers. WCN 3980 Mobile Phone IC
Dependable Performance for Versatile Applications
The WCN 3980 Mobile Phone IC is not just limited to enhancing communication protocols; its versatility makes it suitable for a wide range of applications. From smartphones to IoT devices, its adaptable design ensures compatibility across versatile platforms. The IC is meticulously tested to deliver consistent performance in diverse environments, making it a reliable choice for manufacturers prioritizing quality and efficiency. WCN 3980 Mobile Phone IC
The Qualcomm WCN3980 is a highly integrated, single-die wireless connectivity Integrated Circuit (IC).1 It is designed to provide high-performance Wi-Fi, Bluetooth, and FM radio capabilities for mobile devices, particularly those powered by mid-to-high-tier Snapdragon platforms like the Snapdragon 660, 835, and 845.2
By integrating multiple wireless protocols into a single chip, the WCN3980 helps manufacturers save precious PCB (Printed Circuit Board) space and reduce power consumption in smartphones, tablets, and IoT devices.WCN 3980 Mobile Phone IC`
Core Technical Specifications
The following table breaks down the primary technical capabilities and hardware characteristics of the WCN3980 IC.
| Feature | Specification |
| Manufacturer | Qualcomm |
| Connectivity Standards | Wi-Fi 5 (802.11ac), Bluetooth 5.1, FM Radio |
| Wi-Fi Configuration | 1×1 SISO (Single Input Single Output) |
| Wi-Fi Frequency Bands | Dual-band: 2.4 GHz and 5 GHz |
| Max Wi-Fi Speed | Up to 433 Mbps (802.11ac) |
| Wi-Fi Channel Widths | 20 MHz, 40 MHz, 80 MHz |
| Bluetooth Version | 5.0 (Upgradable to 5.1 in specific revisions) |
| Bluetooth Features | BLE (Low Energy), Dual Mode, aptX Audio support |
| Package Type | WLCSP (Wafer Level Chip Scale Package) |
| Pin Count / Ball Count | 196 balls (Approx. 14×14 grid) |
| BGA Pitch | ~0.35 mm |
| IC Dimensions | Approximately 8mm x 8mm |
Key Functional Areas
1. Wi-Fi Performance
The WCN3980 supports IEEE 802.11a/b/g/n/ac.4 While it uses a 1×1 antenna configuration (compared to the 2×2 MIMO found in the WCN3990/3999), it is optimized for consistent throughput in congested environments. It supports 256-QAM modulation to maximize data rates over the 5 GHz band.
2. Bluetooth & Audio
The integration of Bluetooth 5.0/5.1 ensures high-speed data transfer and extended range for peripherals. It supports Qualcomm’s proprietary audio technologies, such as aptX and aptX HD, which provide high-fidelity wireless audio for headphones and speakers.5 It also includes support for Bluetooth Low Energy (BLE) Mesh and HID profiles for low-latency gaming peripherals.6
3. FM Radio and GNSS
Unlike basic Wi-Fi chips, the WCN3980 often includes an integrated FM receiver (RDS/RBDS supported).7 It also functions as a companion for the System-on-Chip (SoC) to assist with GNSS (Global Navigation Satellite System) signal processing, improving GPS lock times and accuracy.
Common Applications
The WCN3980 is a staple in mid-range and legacy flagship smartphones. Notable devices that utilize this IC include:
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Xiaomi: Mi A2 (6X), Mi 8, Mi 9, Mix 2S, Mix 3.8
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Redmi: Note 5 Pro.
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Snapdragon Development Kits: Frequently used in the Snapdragon 660 and 845 Mobile Hardware Development Kits (HDKs).
Technical Note: Replacing this IC requires professional micro-soldering equipment.9 Because it is a BGA (Ball Grid Array) component with a very fine 0.35 mm pitch, it must be installed using a hot-air rework station with precise temperature profiles to avoid damaging the silicon or the mobile motherboard.
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