SMB 1351 -005 Mobile Phone IC

Powerful Mobile Phone IC for Seamless Performance

The SMB 1351 -005 Mobile Phone IC stands out as a state-of-the-art integrated circuit designed to support the growing demands of mobile devices. Engineered for reliability and efficiency, this IC is the perfect solution for optimizing mobile phone functionality. Whether in production or repair, the SMB 1351-005 delivers superior performance in critical configurations, ensuring devices run smoothly without interruption. SMB 1351 -005 Mobile Phone IC

High Efficiency and Enhanced Compatibility

Built with advanced technological features, the SMB 1351-005 Mobile Phone IC is compatible with a wide range of mobile phone models. Its integration enables faster processing, low power consumption, and extended device life – features highly appreciated in today’s fast-paced world of mobile usability. Additionally, its precision design ensures seamless compatibility with modern circuit boards, making it a trusted choice for manufacturers and technicians alike. SMB 1351 -005 Mobile Phone IC

Why Choose the SMB 1351-005 Mobile Phone IC?

Choosing the SMB 1351-005 IC means investing in quality and reliability. The IC’s robust construction ensures consistent performance under varying conditions, making it ideal for both consumer-grade devices and professional industrial uses. Backed by durability and advanced engineering, it supports increased efficiency in signal processing, power management, and overall mobile operation. Experience optimized device performance without compromise, thanks to the reliable functionality of this high-quality mobile phone IC. SMB 1351 -005 Mobile Phone IC

The SMB1351-005 is a highly integrated, programmable battery management and fast-charging Integrated Circuit (IC) developed by Qualcomm (originally part of the Summit Microelectronics acquisition). It is a staple component in mid-to-high-end Android smartphones, most notably within the Xiaomi, LeEco, and Motorola ecosystems.

Commonly referred to as a “Parallel Charging IC” or “Quick Charge IC,” its primary role is to manage high-current power delivery from a USB source to the lithium-ion battery while minimizing heat generation within the device. SMB 1351 -005 Mobile Phone IC

Technical Specifications

The following table outlines the key electrical and physical parameters of the SMB1351-005:

Feature	Specification Details
Manufacturer	Qualcomm (Summit Microelectronics)
Part Number	SMB1351-005 / SMB1351
Function	Switch-Mode Battery Charger / USB Power Delivery
Charging Technology	Support for Quick Charge 2.0 / 3.0
Input Voltage (VBUS)	4.5V to 13.5V (Supports High Voltage Fast Charging)
Output Current	Up to 3.0A+ (depending on thermal and system limits)
Package Type	WLCSP (Wafer Level Chip Scale Package) / BGA
Pin/Ball Count	49-Ball (typically 7×7 grid)
Communication	$I^2C$ Interface for host control/monitoring
Efficiency	>90% at peak charging rates
Protection Features	OVP (Over Voltage), OCP (Over Current), Thermal Shutdown
Operating Temp	-40°C to +85°C (Internal junction up to 125°C)

Key Features and Capabilities

The SMB1351-005 is designed to solve the “thermal bottleneck” in modern smartphones. When a phone charges at high speeds, the internal resistance causes heat. The SMB1351 mitigates this through:

Parallel Charging: It often works alongside a primary Power Management IC (PMIC). While the main PMIC handles system power, the SMB1351 acts as a secondary path to “inject” additional current directly into the battery, spreading the thermal load across the motherboard. SMB 1351 -005 Mobile Phone IC
Dynamic Voltage Scaling: It communicates with the wall adapter via the USB DP/DM lines to negotiate the highest safe voltage (e.g., jumping from 5V to 9V or 12V), allowing more power to flow through thin USB cables without excessive heat.
Programmability: Through its $I^2C$ lines, the device’s firmware can adjust charging parameters in real-time based on the battery’s current temperature and state of charge (SoC).

Pinout Configuration (Functional Groups)

While a full 49-ball map is specific to the datasheet, the pins are grouped into these critical functional areas:

VBUS: Input power from the USB port.
SW (Switching): Connection to the external inductor for DC-DC conversion.
VBAT / BAT_SENSE: Connection to the positive terminal of the battery for current delivery and voltage monitoring.
SCL / SDA: $I^2C$ clock and data lines for communication with the CPU.
STAT: Status output pin (often drives a charging LED or notification).
INT: Interrupt pin to alert the processor of charging events or faults.

Common Application Models

This IC is frequently found in the following devices:

Xiaomi: Mi 5, Mi Note 2, Redmi Note 3 Pro, Redmi Note 8 Pro. SMB 1351 -005 Mobile Phone IC
LeEco: Le Max 2 (X820/X829).
Motorola: Various Moto Z and G series models utilizing TurboPower.

SMB 1351 -005 Mobile Phone IC