BQ 24158 Original Mobile Phone IC
Reliable Performance and Durability
Our BQ 24158 Original Mobile Phone IC is meticulously designed to deliver superior performance and reliability. Ideal for integrating into your device’s power management system, this IC ensures that your mobile phone operates seamlessly and efficiently. BQ 24158 Original Mobile Phone IC
Compact and High-Quality Design
Crafted with precision, the BQ 24158 IC boasts a compact and durable construction. Its original, high-quality components maximize power regulation and extend the longevity of your device, making it a fantastic choice for repairs or upgrades. BQ 24158 Original Mobile Phone IC
Versatile Compatibility
The BQ 24158 is highly compatible with a wide range of mobile phone models, making it an essential component for technicians and DIY enthusiasts. Whether you’re replacing a faulty IC or optimizing your device, this product delivers proven results and unparalleled efficiency. BQ 24158 Original Mobile Phone IC
The BQ24158 is a highly integrated, switch-mode battery charge management device designed specifically for single-cell Lithium-Ion (Li-Ion) and Lithium-Polymer (Li-Poly) batteries. Produced by Texas Instruments (TI), this IC is a staple in the mobile phone industry—found in devices from brands like Xiaomi and Oppo—due to its high efficiency and ability to handle USB On-The-Go (OTG) requirements. BQ 24158 Original Mobile Phone IC
Below are the detailed specifications and technical parameters for the BQ24158. BQ 24158 Original Mobile Phone IC
Technical Specifications Table
| Parameter | Specification Details |
| Manufacturer | Texas Instruments (TI) |
| Model Series | BQ2415x (Specifically BQ24158) |
| Battery Chemistry | Single-Cell Li-Ion or Li-Polymer |
| Topology | Switch-Mode Buck (Synchronous PWM) |
| Input Voltage (Min/Max) | 4.0 V to 6.0 V (Operating) |
| Absolute Max Input Voltage | 20 V (Withstands high voltage spikes) |
| Max Charge Current | 1.25 A (Programmable via I2C) |
| Output Regulation Voltage | 3.5 V to 4.44 V (Programmable) |
| PWM Frequency | 3 MHz (Fixed frequency) |
| I2C Interface Speed | Up to 3.4 Mbps (High-speed mode) |
| Overvoltage Protection (VOVP) | 6.5 V |
| USB OTG Boost Output | 5.05 V / 200 mA |
| Package Type | 20-Pin WCSP (Wafer Chip Scale Package) |
| Physical Dimensions | 2.1 mm x 2.0 mm |
Key Features & Functionality
1. High-Efficiency Charging
Unlike older linear chargers that dissipate excess energy as heat, the BQ24158 uses a 3 MHz synchronous PWM controller. This allows for faster charging with significantly less thermal buildup, which is critical for the slim profiles of modern smartphones. BQ 24158 Original Mobile Phone IC
2. USB-OTG Support
The BQ24158 includes a Boost Mode operation. When a mobile device needs to act as a host (to power a USB flash drive or keyboard), the IC can boost the battery voltage (2.5 V to 4.5 V) up to a stable 5.05 V to power the external VBUS line.
3. Precision Regulation
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Voltage Accuracy: ±0.5% at room temperature (25°C), ensuring the battery is never overcharged.
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Current Accuracy: ±5% for input current regulation, which helps in strictly adhering to USB 100 mA or 500 mA limits.
4. Dynamic Power Management (DPM)
The IC features VIN-DPM, which prevents the system from crashing if the input source (like a weak wall adapter) cannot provide enough current. It automatically reduces the charge current to maintain a stable system voltage.
Pin Configuration and Layout
The 20-pin WCSP package is designed for minimal board space. Key pins include:
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VBUS: Input power from the USB connector.
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SW: Switched node for the inductor.
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CSIN/CSOUT: Pins for the external sensing resistor to monitor charge current.
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SDA/SCL: I2C data and clock lines for host communication.
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STAT: Status output pin for LED or processor notification of charging/faults.
Common Applications in Mobile Repair
The BQ24158 is frequently replaced in mobile repair shops because it is the “front line” of the charging circuit. It is often the first component to fail due to:
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Voltage Surges: Using non-original or “fake” chargers that exceed the 20V absolute maximum.
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Liquid Damage: Corrosion around the small solder balls of the WCSP package.
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Thermal Stress: Prolonged fast-charging in high-ambient temperatures.
Note for Technicians: When replacing this IC, professional BGA (Ball Grid Array) soldering tools and a microscope are required due to the extremely small 2.1mm x 2.0mm footprint.
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