Mobile Phone IC For PM8350BHS-0001 Original
PM8350BHS-0001 Original Technical Specifications
The following table details the electrical characteristics, communication protocols, and physical specifications of the original component.
| Feature / Parameter | Specification Details |
| Manufacturer | Qualcomm Technologies, Inc. |
| Model Variation | PM8350BHS-0001 (Version 001-00) |
| Package Type | BGA (Ball Grid Array) / WLCSP |
| Main Functions | Power Management, Switched-Mode Charging, Voltage Regulation |
| Input Voltage (VBAT) | 3.0V to 4.4V (Typical Li-ion range) |
| Core Voltage Steps | 12.5mV precision (I²C / SPMI controlled) |
| Communication Interface | SPMI (System Power Management Interface) & I²C (Slave 0x48) |
| Buck Converters | Multi-rail (Core, GPU, I/O domains) |
| Peak Efficiency | ~94.2% (at 3.0A core load) |
| Output Current (Core) | Up to 4.0A Max |
| Thermal Protection | Integrated OTP (Over-Temperature Protection) |
| ESD Protection | Integrated Human Body Model (HBM) protection |
Key Capabilities and Role
The PM8350BHS is an essential “sub-PMIC” that operates alongside the primary PM8350. Its architecture is optimized for three critical areas of smartphone performance:
1. Advanced Power Delivery
The IC is capable of Dynamic Voltage Scaling (DVS).2 This allows the processor to request specific voltage increases or decreases in $12.5mV$ increments. For example, during heavy gaming, the 3$VDD\_GPU$ can scale up to 4$1.1V$ for stability, while dropping to lower levels during idle to preserve battery.5
2. High-Efficiency Thermal Management
Thermal stability is a hallmark of the PM8350BHS.6 In comparison to legacy PMICs, this chip maintains a significantly lower thermal rise (typically ΔT of 22°C above ambient under load).7 This makes it ideal for gaming phones like the ASUS ROG Phone series, where sustained performance is critical.
3. Integrated Charging Control
The PM8350BHS often handles the secondary charging path in dual-cell battery configurations. It supports modern fast-charging standards and integrates protection logic to prevent overvoltage ($OVP$) during high-wattage charging cycles.
Supported Devices and Common Use Cases
This IC is a high-value replacement part in the mobile repair industry.8 It is most commonly found in devices using the Snapdragon 888 chipset:
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Xiaomi: Mi 11, Mi 11 Ultra, Mi Mix Fold, Redmi K40 Pro.9
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ASUS: ROG Phone 5, ROG Phone 5S, ROG Phone 6.10
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Samsung: Galaxy S21 series (Qualcomm variants), Galaxy A50/A70 (specific regional repairs).
Technical Repair Guidance
When diagnosing a device suspected of having a faulty PM8350BHS, technicians typically look for “dead” states or no-charging symptoms.11
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Boot Sequence: The PM8350BHS must receive a “Power Good” signal from the main PMIC before it initiates its own voltage rails.
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Soldering Profile: Due to its BGA structure, it requires a precision stencil and a reflow temperature between 300°C and 350°C for 60–90 seconds, depending on the station brand.
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Short Circuit Check: Common failure points include the capacitors surrounding the $VDD\_CORE$ and $VDD\_GPU$ pins. A short to ground on these lines often indicates a failed IC.
