Amaoe UN2 BGA Reballing Stencil-Original

Unmatched Accuracy for Reballing Tasks

The Amaoe UN2 BGA Reballing Stencil-Original stands out as a reliable and high-quality tool designed for precise BGA chip repair. Crafted to meet the standards of professionals, it ensures accurate alignment, making reballing tasks smoother and more efficient. Amaoe UN2 BGA Reballing Stencil-Original

Durable and High-Quality Construction

Engineered with durability in mind, this stencil is made from premium materials, offering exceptional resistance to wear and tear. Whether you’re a technician or a hobbyist, the Amaoe UN2 BGA Reballing Stencil guarantees longevity and consistent performance every time. Amaoe UN2 BGA Reballing Stencil-Original

Versatile and Easy to Use

Featuring a user-friendly design, this stencil supports various BGA chip sizes, providing versatility for multiple repair scenarios. Its compatibility and ergonomic structure ensure seamless integration into your repair toolkit. Simplify your chip repairs with this dependable tool! Amaoe UN2 BGA Reballing Stencil-Original

The Amaoe UN2 BGA Reballing Stencil is a high-precision maintenance tool designed specifically for the Unisoc (Spreadtrum) chipset ecosystem. Within the repair industry, Amaoe is recognized for using high-quality Japanese steel that balances flexibility with thermal stability, preventing the “warping” or “doming” effect common in cheaper stencils. Amaoe UN2 BGA Reballing Stencil-Original

The UN2 model is part of a specialized series (UN1, UN2, etc.) that targets newer generation Unisoc CPUs and power management ICs often found in budget to mid-range Android smartphones and IoT devices. Amaoe UN2 BGA Reballing Stencil-Original

Technical Specifications: Amaoe UN2

Feature	Specification Details
Model Number	UN2 (Unisoc Series 2)
Manufacturer	Amaoe (Tianmu)
Material	High-Grade Japanese Stainless Steel
Thickness	0.12mm (Ultra-thin precision)
Hole Type	Square-round (Cylindrical with tapered entry)
Heat Resistance	Up to 450°C (Direct heating compatible)
Primary Chip Support	UMS512T, UMS9230H, UWP51065
Secondary Chip Support	UMW2652, UMP510G, UIP8910, UIS8910
Supported Packages	BGA153, BGA200, BGA CPU footprints
Alignment Tech	Laser-cut precision with CNC finishing

Key Features and Performance

1. Material and Build Quality

The stencil is manufactured from imported stainless steel with a specific chemical composition that allows for “memory” flexibility. This means that if the stencil is slightly bent during the cleaning process, it returns to its original flat state. The 0.12mm thickness is the industry standard for modern mobile CPUs; it is thin enough to ensure the solder paste reaches the pad but thick enough to provide a stable “wall” for the solder ball to form. Amaoe UN2 BGA Reballing Stencil-Original

2. Square-Round Hole Design

Unlike older stencils with strictly round holes, the UN2 utilizes square-round apertures. These holes are slightly wider at the top and taper toward the bottom. This design serves two purposes:

Easy Demolding: It prevents the solder paste from sticking to the stencil when you lift it.
Ball Formation: It guides the solder ball into a more uniform sphere during the reflow process, reducing the risk of “bridging” (two balls merging).

3. Chipset Compatibility

The UN2 is highly specific. While a “Universal” stencil might have a generic grid, the UN2 has the exact footprint for the Unisoc UMS512T (Tiger series) and UMS9230H. These chips are notoriously dense, and using a universal stencil often results in misaligned balls on the outer rows. The UN2 includes dedicated areas for: Amaoe UN2 BGA Reballing Stencil-Original

CPU/GPU SoCs: Targeted at the Tiger T610, T618, and T700 series.
Power Management (PMIC): Specific layouts for Unisoc-based power chips like the UMP510G.
RF & Connectivity: Support for UMW2652 (Wi-Fi/BT modules).

Usage Guidelines for Professionals

To maximize the lifespan of the Amaoe UN2 stencil and ensure a 100% success rate during reballing, follow these technical steps:

Preparation: Clean the IC surface thoroughly using a wick and soldering iron. Ensure the chip is perfectly flat.
Alignment: Align the stencil apertures with the IC pads. The Amaoe UN2 features clear laser-etched markings to help identify the chip orientation.
Paste Application: Use a high-quality solder paste (typically 183°C leaded or 217°C lead-free). Apply the paste using a scraper at a 45° angle to ensure the holes are packed tightly.
Heating: Use a hot air station set to approximately 300°C–330°C with low airflow. Hold the stencil down with tweezers at the edges to prevent heat expansion from lifting the center.
Cooling: Allow the stencil to cool for 5–10 seconds before lifting. This “sets” the balls and prevents them from shearing off.

Maintenance Note

The Amaoe UN2 should be cleaned with 99% Isopropyl Alcohol (IPA) or a dedicated PCB cleaner immediately after use. Avoid using metal scrapers to clean dried paste out of the holes, as this can scratch the interior walls of the apertures and cause future sticking issues. Amaoe UN2 BGA Reballing Stencil-Original

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Weight	0.05 kg

Amaoe UN2 BGA Reballing Stencil-Original