AMAOE Stencil Original XIAOMI MI6
Crafted for Precision
The AMAOE Stencil Original XIAOMI MI6 is specifically designed for the XIAOMI MI6, enabling seamless and accurate repair work. Whether you’re replacing damaged components or performing intricate soldering tasks, this stencil delivers unmatched precision to help maintain your device’s original performance. AMAOE Stencil Original XIAOMI MI6
Reliable and Durable Build
Manufactured with high-quality materials, this stencil ensures durability and resilience for repetitive use. Its robust design resists warping, making it the ideal choice for professionals and DIY enthusiasts seeking reliable repair tools for their XIAOMI MI6. AMAOE Stencil Original XIAOMI MI6
Easy to Use, Superior Results
This stencil’s user-friendly design guarantees effortless alignment and precision, saving you time and effort during repairs. With AMAOE’s focus on quality and accuracy, you can trust this original stencil to deliver exceptional performance every step of the way. AMAOE Stencil Original XIAOMI MI6
When it comes to high-end mobile repair, AMAOE is essentially the “Gold Standard.” If you are looking for the specifications for the AMAOE Stencil for the Xiaomi Mi 6, it is important to clarify a common point of confusion in the repair industry:
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AMAOE MI:1 is the stencil for the Xiaomi Mi 6 flagship (Qualcomm Snapdragon 835 / MSM8998).
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AMAOE MI:6 is actually designed for mid-range chips like the Snapdragon 636/660 (found in the Mi 6X and Redmi Note 5). AMAOE Stencil Original XIAOMI MI6
Since you asked for the Original Xiaomi Mi 6 specifications, I have provided the technical details for the AMAOE MI:1 stencil (which services the Mi 6) alongside the full hardware specifications of the smartphone itself. AMAOE Stencil Original XIAOMI MI6
1. AMAOE MI:1 Reballing Stencil Specifications
This stencil is a precision tool used by technicians to “reball” (replace solder balls) on the integrated circuits (ICs) of the Xiaomi Mi 6.
| Feature | Specification |
| Model Name | AMAOE MI:1 (Xiaomi 6 / Mix 2 Series) |
| Material | High-grade Japanese Stainless Steel |
| Thickness | 0.12mm (Industry Standard for Precision) |
| Hole Type | Square Hole (Prevents solder paste sticking) |
| Supported CPU | Qualcomm Snapdragon 835 (MSM8998) |
| Supported ICs | CPU, RAM, PM8998 (PMIC), WiFi, Audio, EMMC/UFS |
| Heat Resistance | High (Deformation-resistant under direct heat) |
| Weight | ~0.01 kg |
| Dimensions | ~10cm x 8cm |
2. Xiaomi Mi 6 (Smartphone) Full Specifications
The Xiaomi Mi 6 was a landmark flagship for the brand, featuring a “four-sided curved glass” design and the powerful Snapdragon 835.
Core Hardware & Performance
| Component | Specification |
| Chipset | Qualcomm Snapdragon 835 (10nm process) |
| CPU | Octa-core (4×2.45 GHz Kryo & 4×1.9 GHz Kryo) |
| GPU | Adreno 540 |
| RAM | 4GB / 6GB LPDDR4x |
| Storage | 64GB / 128GB (UFS 2.1) – No Card Slot |
| AnTuTu Score | ~184,000 (at launch) |
Display & Design
| Feature | Details |
| Display Type | IPS LCD, 600 nits brightness |
| Size | 5.15 inches |
| Resolution | Full HD (1920 x 1080 pixels), 16:9 ratio |
| Pixel Density | 428 ppi |
| Build | Gorilla Glass 4 front/back, Stainless Steel frame |
| Special Editions | Ceramic Edition (18k Gold camera rims) |
| Weight | 168g (Glass) / 182g (Ceramic) |
Camera & Multimedia
| Feature | Details |
| Rear Camera (Dual) | 12 MP (f/1.8, Wide) + 12 MP (f/2.6, Telephoto) |
| Zoom | 2x Optical Zoom, 10x Digital Zoom |
| Video Recording | 4K @ 30fps, 1080p @ 30fps, 720p @ 120fps |
| Selfie Camera | 8 MP, 1080p video |
| Audio | Stereo Speakers, No 3.5mm Headphone Jack |
Connectivity & Battery
| Feature | Details |
| Battery | 3,350 mAh (Non-removable) |
| Charging | 18W Fast Charging (Quick Charge 3.0) |
| USB | Type-C 1.0 reversible connector |
| Network | 4G LTE, Dual Nano-SIM |
| WLAN | Wi-Fi 802.11 a/b/g/n/ac, Dual-band, MU-MIMO |
| Sensors | Fingerprint (Front-mounted), Barometer, Gyro, NFC |
Why These Stencils Matter
The AMAOE stencils are preferred because of their 0.12mm thickness. If a stencil is too thin, it warps under the heat of a rework station; if it’s too thick, it leaves too much solder, causing “bridges” (shorts) between the pins. The square-hole design is also critical—it allows the solder paste to release cleanly, which is vital for the 0.4mm pitch pins found on the Snapdragon 835.
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