115749-25 Mobile Phone IC
Compact Design for Modern Mobile Devices
The 115749-25 Mobile Phone IC is designed to meet the demands of today’s compact and lightweight devices. Its sleek design and efficient performance make it an essential component for modern mobile technology enthusiasts. 115749-25 Mobile Phone IC
Optimized for Performance and Efficiency
This mobile phone IC offers seamless integration with a wide range of mobile devices. Engineered for reliability, it enhances device performance while maintaining energy efficiency, ensuring prolonged battery life. 115749-25 Mobile Phone IC
Reliability You Can Trust
The 115749-25 Mobile Phone IC is built to provide consistent performance and durability. Whether for personal use or large-scale production, its superior quality ensures it meets the highest standards for reliability and precision. 115749-25 Mobile Phone IC
The 115749-25 (often referred to by its full part number SKY115749-25) is a specialized Power Amplifier (PA) Integrated Circuit primarily manufactured by Skyworks Solutions. It is a critical component in the Radio Frequency (RF) front-end section of various Samsung Galaxy and other Android smartphones, responsible for amplifying weak signals before they are transmitted via the device’s antenna. 115749-25 Mobile Phone IC
Below are the full technical specifications and details for the 115749-25 IC. 115749-25 Mobile Phone IC
115749-25 Technical Specifications
| Parameter | Details / Specification |
| Part Number | 115749-25 / SKY115749-25 |
| Component Type | Power Amplifier (PA) / RF IC |
| Main Function | RF Signal Amplification & Power Regulation |
| Package Type | SMD (Surface Mount Device) / BGA (Ball Grid Array) |
| Pin Count | 54 Pins |
| Compatible Brands | Samsung, Xiaomi, Oppo, Vivo |
| Power Consumption | ~0.5W (Typical Operating Dissipation) |
| Operating Voltage | 3.4V to 4.2V (VCC / VBATT) |
| Communication Mode | 4G LTE, 3G WCDMA, 2G GSM Support |
| Material Composition | Heat-resistant high-grade Silicon/Ceramic |
| Weight | ~0.01g to 0.03g (Chip only) |
| Standard Color | Black |
Functional Overview
In the architecture of a modern mobile device, the 115749-25 sits between the Transceiver (which generates the low-power RF signal) and the Antenna. Because mobile signals must travel long distances to reach a cell tower, they require significant “boosting.“
The 115749-25 performs the following roles:
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Signal Strengthening: Amplifies low-power RF signals to a level suitable for transmission. 115749-25 Mobile Phone IC
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Efficiency Management: Modern “SkyBlue” or similar technology in these chips ensures that power is used efficiently to prevent excessive battery drain. 115749-25 Mobile Phone IC
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Thermal Control: Engineered to handle the heat generated during high-speed data transmission (like streaming or 4G LTE uploads). 115749-25 Mobile Phone IC
Device Compatibility List
This IC is widely used in several mid-range and “Pro” series Samsung devices. It is often the “go-to” replacement for network-related motherboard repairs.
Primary Compatible Models:
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Samsung C-Series: C5000 (C5 Pro), C7000 (C7 Pro), C900F (C9 Pro)
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Samsung A-Series: A320F (Galaxy A3 2017)
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Samsung J-Series: J250F (Galaxy J2 Pro/Prime), J210
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Other Devices: Various Xiaomi and Oppo models using similar RF front-end architectures.
Common Symptoms of a Faulty 115749-25 IC
If this IC fails or becomes “leaky” (drawing excess current), the smartphone will exhibit specific hardware-level issues:
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Network Failure: “No Service,” “Emergency Calls Only,” or very weak signal bars even in high-coverage areas.
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Overheating: The device gets noticeably hot near the top section of the motherboard during calls or data usage.
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Battery Drain: Rapid battery depletion due to a short circuit within the IC’s power rails.
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Boot Issues: In some cases, a shorted 115749-25 can pull down the main power line (VBATT), causing the phone to be stuck on the logo or fail to turn on entirely.
Repair & Handling Guidelines
Replacing the 115749-25 requires professional SMD Rework skills. Because it is a 54-pin BGA chip, precise alignment is necessary.
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Temperature Profile: When using a hot air station, technicians typically use a temperature range of 330°C to 360°C with low airflow to avoid shifting neighboring small components.
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Reballing: If the IC is being reused, a specialized stencil is required to re-apply the solder balls.
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Orientation: Always note the “Dot” marker on the top of the IC to ensure correct pin-1 orientation on the PCB.
Note: This IC is sensitive to Electrostatic Discharge (ESD). Ensure you are using an anti-static mat and wrist strap when performing motherboard-level repairs.
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