Amaoe Mi10 BGA Reballing Stencil-Original

Original price was: ₹650.00.Current price is: ₹326.00.

Amaoe Mi10 BGA Reballing Stencil-Original

The Amaoe Mi10 BGA Reballing Stencil-Original is a high-precision maintenance tool specifically engineered for the Xiaomi 9 and Redmi K20 series. As a staple in the toolkit of professional mobile technicians, it is designed to facilitate the complex “tin planting” process—applying solder paste and forming solder balls on Ball Grid Array (BGA) chips like CPUs and RAM.

Below are the comprehensive specifications and features of the original Amaoe MI:10 stencil. Amaoe Mi10 BGA Reballing Stencil-Original

Technical Specifications

Attribute Specification Details
Brand Amaoe (Original)
Model Number MI:10 (MI10)
Material High-Quality Japanese Imported Stainless Steel
Thickness 0.12mm (Standard High-Precision)
Aperture Design Square Hole (with rounded corners to prevent tin sticking)
Manufacturing Process High-Precision Laser Cutting
Heat Resistance High-temperature resistance (up to 400°C–500°C during reflow)
Compatible Brands Xiaomi, Redmi
Net Weight Approx. 0.02kg (Lightweight for manual handling)
Dimensions Approx. 10cm x 8cm (Standard repair sheet size)

Chipset & IC Compatibility

The MI:10 is a versatile “multi-net” stencil, meaning it contains multiple layouts for various integrated circuits found on a single device’s logic board. It is primarily centered around the Qualcomm Snapdragon 855 ecosystem. Amaoe Mi10 BGA Reballing Stencil-Original

Component Category Supported IC Models / Chipsets
Processors (CPU) SM8150 (Snapdragon 855), SM7150 (Snapdragon 730/730G)
Memory (RAM) SM8150 RAM (LPDDR4X Layer)
Power Management (PMIC) PM8150, PM8150A, PM8150B, PM7150, PM7150A
Radio Frequency (RF) SDR8150, SDR660
Audio IC WCD9340
Device Models Xiaomi Mi 9, Redmi K20, Redmi K20 Pro

Core Features & Benefits

  • Anti-Drumming Design: The stencil features specialized “cooling holes” or “semi-occluded” patterns that prevent the metal from expanding or “bulging” (drumming) when subjected to the high heat of a hot air gun.

  • Precision Alignment: Every hole is laser-etched to match the microscopic solder pads of the SM8150 CPU. This reduces the risk of “bridges” (shorts) between pins.

  • Easy Demolding: The inner walls of the apertures are polished to ensure that once the solder paste has melted and solidified into balls, the stencil can be lifted without pulling the balls off the chip.

  • Durability: Unlike cheaper clones, the original Amaoe stainless steel is resilient against warping. It maintains its flat profile through hundreds of repair cycles if cleaned and stored properly.

Usage Recommendations for Technicians

To maximize the lifespan of the Amaoe MI:10 and ensure a perfect reball every time, follow these industry-standard practices:

  1. Solder Paste Selection: Use a high-quality solder paste with a melting point of 183°C (Leaded) for better reliability or 217°C (Lead-Free) if required by local standards.

  2. Heat Management: When using a hot air rework station, keep the airflow moderate (usually around 3-4 on a scale of 10) and the temperature between 330°C and 350°C to avoid thermal shock to the CPU.

  3. Cleaning: Always clean the stencil immediately after use using 99% Isopropyl Alcohol (IPA) and a soft-bristled ESD brush. Dried solder paste in the apertures is the primary cause of alignment failure in future jobs.

Unmatched Accuracy in Reballing

The Amaoe Mi10 BGA Reballing Stencil brings unparalleled precision to device repair tasks. Designed for professionals and enthusiasts alike, it ensures reliable solder ball placement for flawless microchip reballing, saving time and effort. Amaoe Mi10 BGA Reballing Stencil-Original

Durable and Original Build

Made from high-quality materials, this stencil is built to withstand repeated use without compromising its structure. As an original Amaoe product, it offers a level of durability and authenticity you can trust in each application. Amaoe Mi10 BGA Reballing Stencil-Original

Versatile Compatibility

Perfectly compatible with a range of devices, the Mi10 stencil supports various reballing needs. Whether you’re working on complex circuits or repairing everyday gadgets, this tool is an essential addition to your toolkit. Amaoe Mi10 BGA Reballing Stencil-Original

Amaoe Mi10 BGA Reballing Stencil-Original

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Official Website : https://www.mi.com/in/event/diwali-with-xiaomi/?gad_source=1&gad_campaignid=20258278065&gbraid=0AAAAADgqOSa9QQ1kcS-0O-N8xVXB9KSib&gclid=CjwKCAjwlt7GBhAvEiwAKal0cooIWQHfrFYpsA8dtYy2MRvmAGrXPwl15jU4hyRj-1GzCSCNoihMFhoCmncQAvD_BwE

 

Weight 0.05 kg
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