Name: Best Amaoe MI15 BGA Reballing Stencil-Original For Mi12/ 12Pro/ K50 - gaffarmarketdelhi.com
Price: 279.00 INR
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Amaoe MI15 BGA Reballing Stencil-Original For Mi12/ 12Pro/ K50

Field	Specification
Product Name	Amaoe MI15 BGA Reballing Stencil — Original
Model / SKU	MI15
Compatible Device(s) / Chips	Xiaomi Mi 12 / Mi 12 Pro / Mi 12X and Redmi K50 (Qualcomm SM8450 / SM8250 family — CPU / RAM / related IC reballing).
Stencil Type	BGA reballing / solder-paste application stencil (precision template for ball/paste placement).
Primary Use	Reballing BGA packages (CPU/SoC, RAM modules, PMICs) and controlled solder paste deposition on the target board area.
Material	High-grade stainless steel (precision etched).
Standard Thickness	0.12 mm (0.12 mm is the commonly listed thickness for MI15 stencils).
Aperture Geometry	Square / micro-etched apertures matching the Mi12 family BGA pad geometry (designed to prevent bridging and ensure ball retention).
Aperture Size / Ball Recommendation	Aperture sizes matched to the device pad pitch; typical recommended solder ball / paste volume corresponds to ~0.30–0.45 mm ball sizes depending on pad — verify with your pad diameter.
Positional Tolerance / Precision	High-precision etching; micron-level placement tolerances suitable for mobile SoC BGA layouts.
Surface Finish	Smooth, matte/anti-glare finish for improved paste visibility and release.
Flatness / Planarity	Manufactured to maintain good planarity for uniform contact; use frame/jig for best results. Amaoe MI15 BGA Reballing Stencil-Original For Mi12/ 12Pro/ K50
Included Items (typical listing)	1 × MI15 stencil sheet. Some sellers offer the stencil as part of a kit (positioning plate, magnetic base, alignment tools) — check product listing.
Reusability	Reusable — expected dozens to hundreds of cycles if cleaned and handled correctly.
Cleaning / Maintenance	Clean with isopropyl alcohol (IPA) and soft brush; use dedicated stencil cleaner or ultrasonic bath for heavy residues.
Operating / Reflow Notes	Stencil itself is used at room temperature for paste/ball placement; final reflow profile follows the chosen solder paste (SAC305 etc.).
Packaging	Protective sleeve / anti-static packaging (varies by merchant).
Net Weight & Dimensions	Lightweight metal sheet; typical sheet width/height listed on some retail pages around 8×10 cm (varies by batch/seller).
Manufacturer / Brand	Amaoe (original)
Country of Origin	Manufactured in China (Amaoe tooling/spec).
Compliance	Typically RoHS-friendly (metal stencil material / lead-free solder workflows recommended).
Storage Recommendations	Store flat in anti-static sleeve, dry environment, avoid bending or stacking heavy objects on the sheet.
Handling Warnings	Do not touch aperture surfaces with bare fingers; handle by edges using gloves or tweezers to avoid oil contamination.
Warranty / Returns	Seller/manufacturer dependent — check merchant policy before purchase.
Typical Retail Price Range	Low-cost accessory (often sold singly at modest prices; check local reseller for exact pricing).
Seller Notes	Some listings combine MI15 with other MI-series stencils or sell as part of multi-stencil sets — confirm exact pattern (MI15) matches your board before ordering.

Explanatory notes & practical tips

Compatibility check: MI15 is manufactured to match the BGA pad layout used by Xiaomi Mi12 series and Redmi K50 (Qualcomm SM8450/SM8250 family). Always visually confirm the stencil aperture layout against the actual board/pad pattern before attempting reballing — minor board revisions may differ. Amaoe MI15 BGA Reballing Stencil-Original For Mi12/ 12Pro/ K50
Why 0.12 mm thickness matters: 0.12 mm is a common thickness for mobile SoC stencils because it balances rigidity (so the stencil does not warp) with the ability to produce the correct paste/ball volume for typical phone BGA pads. Using a much thinner or thicker stencil may change deposit volume and reliability. Amaoe MI15 BGA Reballing Stencil-Original For Mi12/ 12Pro/ K50
Single-sheet vs kit: Some sellers list MI15 as a single stencil sheet (pack of 1). Others sell a kit that includes an alignment plate, magnetic base or small tools to help positioning — these kits can make reballing faster and reduce alignment errors. Verify the exact included items before purchase. Amaoe MI15 BGA Reballing Stencil-Original For Mi12/ 12Pro/ K50
Cleaning and reuse: After each use remove flux and solder residues with IPA and a soft brush. For stubborn residues, use ultrasonic cleaning with appropriate solvent. Avoid scraping apertures with hard metal objects — this deforms aperture walls and shortens stencil life. Amaoe MI15 BGA Reballing Stencil-Original For Mi12/ 12Pro/ K50
Practical workflow tips: Place the stencil on a flat alignment jig, gently seat it, apply solder balls or paste, remove excess with a squeegee, then lift the stencil straight up (no twisting) to avoid smearing. After reflow, inspect under magnification for bridging or insufficient wetting. Amaoe MI15 BGA Reballing Stencil-Original For Mi12/ 12Pro/ K50