Amaoe Middle Layer Stencil-Original
Unmatched Precision for Intricate Repairs
The Amaoe Middle Layer Stencil-Original is the ultimate solution for professional-grade precision in delicate repair tasks. Designed to withstand repeated use, this middle-layer stencil ensures perfect alignment, enabling seamless micro-component work every time.
Durable Construction, Reliable Performance
Crafted from high-quality, heat-resistant materials, the Amaoe Middle Layer Stencil promises long-lasting durability even under continuous heat applications. Its carefully engineered design minimizes risks of warping or deformation, making it a standout choice for technicians and DIY repair enthusiasts alike. Amaoe Middle Layer Stencil-Original
Designed for Compatibility and Ease
Tailored with precise cutouts for various components, this stencil offers exceptional compatibility with a wide range of devices. Its user-friendly layout ensures a straightforward repair process, saving you time while maintaining professional results. Elevate your repair toolkit with the Amaoe Middle Layer Stencil today! Amaoe Middle Layer Stencil-Original
Amaoe has established itself as a premier manufacturer of precision reballing stencils, particularly favored for the “middle layer” or “middle frame” of modern “sandwich” style motherboards. These stencils are essential for joining the upper and lower logic boards of high-end smartphones like iPhones, Samsung S-series, and various flagship Android devices. Amaoe Middle Layer Stencil-Original
The following tables provide the original specifications for the Amaoe Middle Layer series, focusing on material quality, thickness, and model-specific compatibility. Amaoe Middle Layer Stencil-Original
Technical Specifications: Core Properties
All Amaoe middle layer stencils share a baseline of industrial-grade specifications designed to prevent warping under the high heat of a hot air station.
| Feature | Specification |
| Material | High-grade Japanese Stainless Steel (304/316 equivalent) |
| Hole Design | Square-round (Square with rounded corners) to prevent solder sticking |
| Manufacturing Process | High-precision Laser Cutting & CNC Etching |
| Heat Resistance | Up to 450°C (Anti-bulging / Anti-deformation) |
| Coating | Anti-static, low-friction surface finish |
| Standard Thickness | Generally 0.12mm (Ultra-thin 0.08mm or 0.10mm for specific models) |
iPhone Middle Layer Series (MBGA / IP Series)
iPhones from the X series onward utilize a dual-layer motherboard. Amaoe’s MBGA series is the industry standard for rejoining these layers.
| Model Number | Compatible Devices | Typical Thickness |
| MBGA-X/XS | iPhone X, XS, XS Max | 0.12mm |
| MBGA-11 | iPhone 11, 11 Pro, 11 Pro Max | 0.12mm |
| MBGA-12 | iPhone 12, 12 Pro, 12 Mini | 0.12mm |
| MBGA-12PM | iPhone 12 Pro Max (Extended Layout) | 0.08mm – 0.12mm |
| MBGA-13 | iPhone 13, 13 Pro, 13 Pro Max, 13 Mini | 0.10mm – 0.12mm |
| MBGA-14 | iPhone 14, 14 Plus, 14 Pro, 14 Pro Max | 0.12mm |
| MBGA-15/16 | iPhone 15 & 16 Series (Latest Releases) | 0.12mm |
Android Middle Layer Series
For Android flagship devices, Amaoe provides stencils specifically for the middle frames and “stacked” RAM/CPU configurations.
| Brand | Model Series | Stencil Code Example |
| Samsung | Galaxy S20, S21, S22, S23, S24 Ultra | SAM-Series (e.g., SM-G980F) |
| Samsung Fold | Z Fold & Z Flip Series | ZFlip/ZFold-012 |
| OnePlus | OnePlus 9 Pro, 10 Pro, 11, 12 | 1+9P, 1+10P, 1+11 |
| Xiaomi | Mi 10, 11, 12, 13, 14 Series | MI-10, M12-012, M14P |
| ROG Phone | ASUS ROG 7, 8 | ROG7-Series |
Key Feature Breakdown
1. Square-Round Hole Technology
The most distinctive feature of an original Amaoe stencil is the square-round hole. Traditional round holes often cause “tin beads” to stick inside the mesh. Amaoe’s design allows the solder paste to release cleanly, ensuring uniform solder ball height across the entire middle frame. Amaoe Middle Layer Stencil-Original
2. High-Temperature Durability
Middle layer reballing requires sustained heat over a larger surface area compared to single ICs. Amaoe stencils are treated to have a low thermal expansion coefficient. This ensures that even when the stencil is heated to the melting point of lead-free solder (217°C – 225°C), the holes remain perfectly aligned with the motherboard pads. Amaoe Middle Layer Stencil-Original
3. Precision Alignment
The stencils are often sold as part of a Tin Plating Platform set. These sets include:
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Magnetic Base: To hold the motherboard securely. Amaoe Middle Layer Stencil-Original
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Amaoe Middle Layer Stencil-OriginalPositioning Plate: Synthetic stone or metal plates that “lock” the board in place.
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Steel Mesh: The actual stencil that sits perfectly on top via magnetic or physical alignment pins. Amaoe Middle Layer Stencil-Original
Maintenance & Usage Tips
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Cleaning: Use 99% Isopropyl Alcohol (IPA) and a soft-bristled brush. Avoid metal scrapers that could scratch the surface.
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Storage: Keep stencils in their original protective cardboard or plastic sleeves to prevent bending.
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Solder Paste: Use high-quality medium-temperature (183°C) or high-temperature (217°C) paste depending on the specific manufacturer’s requirements for the middle layer.
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