Amaoe SAM-1 Stencil-Original
Unmatched Quality and Precision
Discover the Amaoe SAM-1 Stencil-Original, meticulously designed for professionals seeking precise solutions to advanced technical challenges. With its superior craftsmanship and durability, this stencil guarantees exceptional accuracy for all your applications. Amaoe SAM-1 Stencil-Original
High-Grade Materials for Enhanced Durability
Engineered with high-quality components, the Amaoe SAM-1 Stencil withstands rigorous use while maintaining its precision. Its robust design ensures long-lasting performance, making it an essential tool for professionals. Amaoe SAM-1 Stencil-Original
A Versatile Choice for Diverse Applications
Whether you are a seasoned technician or an enthusiast, the Amaoe SAM-1 Stencil is perfectly suited for a variety of tasks. Its versatile build supports seamless execution across multiple technical applications, elevating your efficiency and results. Amaoe SAM-1 Stencil-Original
The Amaoe SAM-1 (often categorized within the broader Samsung and high-end repair series) is a precision-engineered BGA reballing stencil. While Amaoe produces dedicated series for the iPhone (such as the U-IP3 for iPhone 6s/6s Plus), the SAM-1 designation is specifically the industry standard for Samsung S8, S8+, and Note 8 series. Amaoe SAM-1 Stencil-Original
For the iPhone 6s and 6s Plus (A9 Chip), the corresponding Amaoe tool is typically the IP6S-A9 or U-IP3 series. Below are the comprehensive specifications for the Amaoe high-precision stencil series designed for these models, provided in the requested tabular format. Amaoe SAM-1 Stencil-Original
Amaoe High-Precision Stencil Series Specifications
The following table details the technical parameters for the Amaoe stencils used in professional motherboard repair for iPhone 6s and 6s Plus. Amaoe SAM-1 Stencil-Original
| Category | Technical Specification | Details |
| Brand | Manufacturer | Amaoe (Authentic/Original) |
| Model Series | iPhone Compatibility | IP6S / IP6S-A9 / U-IP3 |
| Chip Support | Processor | Apple A9 CPU (AP + LPDDR4 RAM) |
| IC Support | Integrated Circuits | Nand Flash, Baseband, Wi-Fi, Audio IC, Power IC (PMIC) |
| Material | Composition | High-Grade Japanese Stainless Steel |
| Sheet Thickness | Precision Gauge | 0.12mm (Ultra-thin for uniform tinning) |
| Hole Design | Aperture Type | Square Hole (Anti-stuck design for easier release) |
| Heat Resistance | Thermal Limit | Up to 450°C (Solder paste reflow ready) |
| Surface Finish | Treatment | Precision Laser-cut, CNC Polished |
| Dimensions | Stencil Size | Approx. 100mm x 80mm (Series dependent) |
| Re-usability | Life Cycle | High (Oxidation-resistant material) |
| Weight | Shipping Weight | ~0.04kg – 0.05kg |
| Application | Primary Use | BGA Reballing, Logic Board Repair, Chip-Level Maintenance |
Technical Features & Design Philosophy
1. Square-Hole Technology
The “SAM” and “IP” series by Amaoe utilize a unique square-hole design rather than traditional round holes. This engineering choice serves two critical purposes:
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Reduced Surface Tension: During the soldering process, solder paste is less likely to stick to the corners of a square hole, allowing the stencil to be lifted cleanly without pulling the solder balls away from the pads.
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Uniform Solder Ball Volume: The square geometry ensures a more consistent volume of tin is deposited, which is vital for the dense pin layout of the A9 CPU.
2. High-Temperature Stability
Amaoe stencils are manufactured from imported Japanese steel that undergoes a specialized quenching process. This prevents the stencil from “bowing” or warping when hit with the high heat of a hot air station (typically $350^{\circ}C$ to $400^{\circ}C$ during reballing).
3. Integrated IC Layout
Unlike universal stencils, the Amaoe 6s/6s Plus dedicated stencil features a 1:1 layout for all critical components:
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A9 CPU/RAM: Large central grid with precise pitch.
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NAND Flash: Dedicated area for memory chip reballing.
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Power Management (PMIC): Peripheral grids for smaller power ICs.
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Baseband/RF: Critical for resolving “No Service” issues on the iPhone 6s series.
Usage Guidelines for Professionals
To maximize the lifespan of your Amaoe stencil and ensure a successful repair, follow these technical steps:
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Alignment: Ensure the IC is cleaned of all old solder using a soldering iron and wick. Use a microscope to align the stencil apertures perfectly with the IC pads.
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Paste Application: Use a high-quality solder paste (e.g., $183^{\circ}C$ or $138^{\circ}C$ depending on the chip sensitivity). Apply with a spatula, ensuring all square holes are filled.
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Heating: Use a circular motion with your hot air gun. Set the airflow to a medium-low setting to prevent the solder balls from jumping or bridging between the 0.12mm gaps.
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Cleaning: Clean the stencil immediately after use with PCB cleaner or 99% Isopropyl Alcohol (IPA) to prevent hardened flux from clogging the apertures.
Note: If you are specifically looking for the SAM-1 (Samsung S8/Note 8) specifications, they share the same 0.12mm thickness and Japanese steel build but feature the layout for the Exynos 8895/Snapdragon 835 processors.
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