Amaoe Sam13 BGA Reballing Stencil-Original
Unparalleled Precision for Your Repair Needs
The Amaoe Sam13 BGA Reballing Stencil-Original is the ideal tool for professional-level chip repairs and soldering tasks. Designed to deliver unmatched precision, this stencil ensures seamless alignment for consistent and reliable results every time. Whether you’re repairing intricate electronics or engaging in micro-soldering, this stencil is tailored to meet your needs. Amaoe Sam13 BGA Reballing Stencil-Original
Durability Meets Efficiency
Crafted with high-quality steel material, the Amaoe Sam13 is built for durability and long-term use. Its heat-resistant and corrosion-proof design helps you tackle any project with ease. The laser-cut apertures provide accurate placement, simplifying repair processes and minimizing errors. Amaoe Sam13 BGA Reballing Stencil-Original
Perfect for Professionals and Hobbyists
Whether you’re a seasoned technician or a DIY enthusiast, this reballing stencil offers both the ease of use and professional-grade quality. Its compact design allows for effortless handling, making it a must-have for anyone working on motherboard BGA chip rework. Bring efficiency and precision to your workstation with the Amaoe Sam13 BGA Reballing Stencil. Amaoe Sam13 BGA Reballing Stencil-Original
The Amaoe SAM13 BGA Reballing Stencil is a professional-grade precision tool engineered specifically for mobile technicians working on Samsung device motherboards. As part of the Amaoe “SAM” series, the SAM13 is a multi-utility stencil that focuses on a wide array of mid-range Samsung processors (Qualcomm Snapdragon and MediaTek) and their supporting power, RF, and WiFi ICs. Amaoe Sam13 BGA Reballing Stencil-Original
Product Overview
This stencil is manufactured using high-quality Japanese imported steel, known for its heat resistance and “anti-drum” properties. The design features square-hole apertures with chamfered edges to ensure that solder balls are formed uniformly and released easily after heating, reducing the risk of “bridging” or uneven solder joints. Amaoe Sam13 BGA Reballing Stencil-Original
Technical Specifications: Amaoe SAM13
The following table outlines the core physical and technical attributes of the original Amaoe SAM13 stencil.
| Feature | Specification Details |
| Brand | Amaoe (Original) |
| Model Number | SAM:13 (Samsung Series) |
| Material | High-Grade Stainless Steel (Imported) |
| Thickness | 0.12 mm (Precision Standard) |
| Aperture Design | Square Hole with CNC Laser Cutting |
| Heat Resistance | Up to 450°C (Anti-deformation) |
| Finish | Anti-glare Matte Silver / Grey |
| Weight | Approx. 0.01 kg – 0.02 kg |
| Compatible Brands | Samsung, Xiaomi, Oppo (using shared chipsets) |
| Process Compatibility | Lead-free & Leaded Solder Paste |
Comprehensive Chipset Compatibility List
The SAM13 is highly valued because it covers a massive range of integrated circuits (ICs) found in the Samsung Galaxy A-series (A10 to A90).
1. Central Processing Units (CPU) & RAM
The stencil includes dedicated grids for the following popular mobile processors:
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Qualcomm Snapdragon: SDM450, SDM660 (Snapdragon 660), SM6150 (Snapdragon 675).
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MediaTek: MT6762V (Helio P22).
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Exynos Support: Compatible with various mid-range Exynos RAM/CPU sandwich configurations.
2. Power Management & Audio ICs (PMIC)
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PM660 / PM660A / PM6150 / PM6150A: Standard power management chips for Snapdragon devices.
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PM8958: Auxiliary power controller.
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MT6357CRV: MediaTek power management unit.
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WCD9370: High-fidelity audio codec chip.
3. RF, WiFi, and Connectivity ICs
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WTR3925: RF Transceiver for 4G LTE.
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SDR660: Intermediate frequency transceiver.
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WCN3990 / WCN3980 / WCN3660B: High-speed WiFi and Bluetooth combo chips.
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VC7643 / VC7916 / 77656-11: Power Amplifier (PA) modules for signal processing.
Key Features of the Original SAM13
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0.12mm Thickness: This specific thickness is the “sweet spot” for mobile BGA repair. It is thick enough to provide structural integrity against heat but thin enough to allow for perfect solder ball height, ensuring the IC sits flush on the PCB. Amaoe Sam13 BGA Reballing Stencil-Original
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Heat-Dissipation Holes: Original Amaoe stencils often feature small auxiliary holes between the main chip grids. These act as vents to prevent the stencil from warping (bulging) under the high heat of a hot air station.
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Laser-Polished Apertures: Unlike cheaper clones, the holes are laser-cut and then polished. This prevents solder paste from sticking to the walls of the stencil when you lift it.
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Accurate Alignment: The stencil is 1:1 scale with the original ICs. The silk-screen labeling on the stencil makes it easy to identify which grid belongs to which chip model. Amaoe Sam13 BGA Reballing Stencil-Original
Recommended Usage Tips
To maximize the lifespan of your Amaoe SAM13, follow these professional guidelines:
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Temperature Control: While the steel is durable, try to keep your hot air station between 300°C and 350°C for reballing. Excessive heat (400°C+) over a long period can eventually cause minor warping.
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Cleaning: Always clean the stencil immediately after use using 99% Isopropyl Alcohol (IPA) and a soft-bristled brush. Dried solder paste in the apertures is the leading cause of failed reballs.
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Solder Paste: Use a high-quality “medium temperature” solder paste (e.g., 183°C) for the best balance of flow and structural strength. Amaoe Sam13 BGA Reballing Stencil-Original
Note: If you are working on the Samsung S-series (like the S21 or S24), you may need the SAM12 or SAM19 stencils, as the SAM13 is primarily geared toward the high-volume A-series and mid-range Snapdragon/MTK models.
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