Amaoe Sam14 BGA Reballing Stencil-Original
High-Quality Manufacturing for Precision
The Amaoe Sam14 BGA Reballing Stencil-Original is expertly crafted to deliver exceptional accuracy and reliability for all your reballing needs. Made from high-grade materials, it ensures durability and precision during use, making it a trusted tool for professionals. Amaoe Sam14 BGA Reballing Stencil-Original
Enhanced Efficiency for Professionals
Designed with convenience in mind, the Sam14 stencil simplifies the complex reballing process, saving you valuable time without compromising on quality. Whether you’re repairing or refurbishing, this tool offers seamless integration into your workflow for a consistent performance. Amaoe Sam14 BGA Reballing Stencil-Original
Perfect Fit for Specialized Applications
Compatible with a wide range of advanced BGA components, the Amaoe Sam14 ensures a perfect fit for your technical requirements. It’s tailored for those who demand high performance and efficiency from their tools, standing out as a reliable companion for intricate tasks. Amaoe Sam14 BGA Reballing Stencil-Original
The Amaoe SAM14 BGA Reballing Stencil is a high-precision repair tool specifically engineered for Samsung’s mid-range Exynos processors and related IC chips. It is widely regarded by technicians for its “Original” Amaoe quality—characterized by heat-resistant stainless steel and square-hole alignment that prevents solder ball bridging. Amaoe Sam14 BGA Reballing Stencil-Original
Below is the detailed technical specification and compatibility data for the Amaoe SAM14.
Core Technical Specifications
| Feature | Specification Details |
| Brand | Amaoe (Authentic/Original) |
| Model Number | SAM:14 (Samsung Series 14) |
| Material | High-Quality Imported Stainless Steel (Chrome-Vanadium Grade) |
| Stencil Thickness | 0.12 mm (Standard for precision reballing) |
| Hole Design | Square holes with rounded corners (Laser-cut) |
| Heat Resistance | Up to 450°C without significant deformation |
| Weight | Approximately 10g – 15g |
| Dimensions | Approx. 100mm x 80mm (Industry Standard Handheld Size) |
| Application | CPU/RAM/Power IC Reballing and Tin Planting |
Processor (CPU) & Platform Compatibility
The SAM14 is a versatile stencil focusing on the Exynos 7 and 9 series architecture found in Samsung Galaxy A-series devices from 2019 to 2021.
| Component Category | Supported Models / Chips |
| Exynos CPUs | Exynos 7870, 7884, 7885, 7904, 9610, 9611 |
| Integrated RAM | Supports LPDDR4X RAM layers often stacked on Exynos 9610/9611 |
| Power Management (PMIC) | S2MU005X03, SM5713, S515, S527S |
| Audio & Connectivity | Shannon 937, BCM43456HKUBG, MU106X01-5 |
| RF & Others | 77656-11, TFBMA, D5328 |
Supported Smartphone Models
This stencil covers a broad range of Samsung Galaxy devices, specifically targeting the “workhorse” models of the Galaxy A and M families.
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Galaxy A Series: A10, A20, A20e, A30, A40s, A50, A51, A70, A7 (2018), A6.
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Galaxy M Series: M10, M20, M30, M30s, M31 (models sharing the Exynos 9611/7904 platforms).
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Specific Board Numbers: A105F, A202F, A305N, A505F, A515F, A530F, A600F, A750F.
Key Performance Features
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Anti-Bulge Technology: The SAM14 is manufactured using a “stepped” or “offset” cooling design that allows the steel to expand and contract during hot air application without warping or “bubbling” up. Amaoe Sam14 BGA Reballing Stencil-Original
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Precision Alignment: The holes are laser-cut to match the exact pitch and diameter of the original Samsung factory solder balls, ensuring a high success rate on the first attempt. Amaoe Sam14 BGA Reballing Stencil-Original
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Square Hole Advantage: Unlike older circular-hole stencils, the SAM14 uses square apertures. This helps the solder paste release more cleanly and prevents the “stuck ball” phenomenon during the lift-off process. Amaoe Sam14 BGA Reballing Stencil-Original
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Chemical Resistance: The stainless steel surface is treated to resist corrosion from various fluxes (RMA or No-Clean) and ultrasonic cleaning solutions.
Usage Recommendations
To maximize the lifespan of your Amaoe SAM14:
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Temperature Control: While the stencil is rated for high heat, it is best to use a hot air station at 330°C to 350°C with low airflow to prevent blowing the balls out of place.
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Cleaning: Clean immediately after use with 99% Isopropyl Alcohol (IPA) and a soft-bristled brush.
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Solder Paste: For best results with a 0.12mm stencil, use 183°C leaded solder paste (Medium temperature) for easier melting and better structural integrity.
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