Amaoe SM8150 BGA Reballing Stencil-Original V1.0
Premium Quality for Professionals
The Amaoe SM8150 BGA Reballing Stencil-Original V1.0 is expertly crafted to meet the demanding needs of professionals working in electronic repair. Engineered with precision, it ensures consistent and reliable chip alignment, making it an essential tool for achieving outstanding results in reballing processes. Amaoe SM8150 BGA Reballing Stencil-Original V1.0
Durable and Long-lasting Design
Manufactured using high-grade materials, this BGA stencil is built for durability and long-term functionality. Its robust structure maintains integrity, even during repetitive use, offering excellent value for repairing chipsets and fine-pitch soldering tasks. Amaoe SM8150 BGA Reballing Stencil-Original V1.0
Seamless Reballing Performance
With its user-friendly design and exact alignment features, the Amaoe SM8150 guarantees effortless handling and precision. Equip your toolkit with this stencil to streamline your workflow and enhance your reballing projects with confidence and ease. Amaoe SM8150 BGA Reballing Stencil-Original V1.0
The Amaoe SM8150 BGA Reballing Stencil (Original V1.0) is a professional-grade precision tool engineered for the repair and maintenance of high-end mobile devices utilizing the Qualcomm Snapdragon 855 chipset. Amaoe has established itself as a leading brand in the micro-soldering industry, and the SM8150 series is specifically tailored for flagship devices such as the Samsung Galaxy S10, LG V50, and Xiaomi Mi 9. Amaoe SM8150 BGA Reballing Stencil-Original V1.0
Below are the detailed specifications and technical data for this model. Amaoe SM8150 BGA Reballing Stencil-Original V1.0
Technical Specifications Table
| Feature | Specification Details |
| Brand | Amaoe (Original Series) |
| Model Number | SM8150 (V1.0) |
| Primary Compatibility | Qualcomm Snapdragon 855 (SM8150) CPU & RAM |
| Material | High-Quality Imported Japanese Stainless Steel |
| Thickness | 0.12 mm |
| Hole Type | Square Round Holes (Precision CNC Laser Cut) |
| Heat Resistance | Up to 450°C (designed for hot air rework) |
| Supported ICs | SM8150 (CPU), PM8150, PM8150A, PM8150B, SDR8150, WCD9340 |
| Manufacturing Process | High-precision chemical etching & laser finishing |
| Dimensions | Approx. 100mm x 80mm (standard plate size) |
| Anti-Warping | Yes (Deformation resistant under high heat) |
Core Features and Design
The Amaoe SM8150 stencil is more than just a metal sheet; it is a high-precision template designed to address the specific challenges of reballing modern, densely packed integrated circuits (ICs).
1. 0.12mm Optimized Thickness
While some generic stencils use 0.1mm or 0.15mm, the 0.12mm thickness of the V1.0 is considered the “Sweet Spot” for the Snapdragon 855. It provides enough solder paste volume to ensure a strong electrical connection but is thin enough to prevent solder bridging between the incredibly close pins of the SM8150 processor.
2. Square-Round Hole Design
One of Amaoe’s signature innovations is the Square-Round hole. Traditional round holes can sometimes cause the solder balls to stick or “clog” during the heating process. The square entry allows for better solder paste release and air ventilation, while the rounded bottom ensures that the resulting solder ball is perfectly spherical.
3. Heat Stability and Durability
Made from premium stainless steel, this stencil is designed to withstand the thermal expansion caused by hot air guns. It features specific “cooling” or expansion slits in some versions to prevent the plate from bulging (warping) during the reballing process, which is the leading cause of failed chip sets.
Supported IC List (Compatibility)
The SM8150 V1.0 is a “multi-purpose” plate for the Snapdragon 855 ecosystem. It includes cutouts for:
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Main CPU: Qualcomm SM8150 (Snapdragon 855).
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Power Management: PM8150, PM8150A, PM8150B, and PM7150 series.
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Radio Frequency (RF): SDR8150 Transceiver.
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Audio Codec: WCD9340.
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Other: Various small power ICs (AFEM-9070) and 77661-11 network chips.
Best Practices for Use
To achieve a “one-click” success rate with the Amaoe SM8150:
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Cleaning: Ensure the IC and the stencil are completely free of old flux and oxidation using 99% Isopropyl Alcohol.
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Paste Application: Use a high-quality 183°C or 138°C solder paste (depending on the device’s heat tolerance).
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Alignment: The laser-cut precision of the SM8150 V1.0 allows for “snap-in” alignment where the chip pads naturally sit into the stencil indentations.
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Heat Control: Use a circular motion with your hot air station set to approximately 330°C–350°C with low airflow to prevent the stencil from lifting.
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