Amaoe SU 3 Bga Stencil-Original
Effortless Precision in Electronics Repair
The Amaoe SU 3 Bga Stencil-Original is designed for professionals seeking accuracy and reliability in electronic repairs. Crafted with high-grade material, this stencil ensures seamless alignment during soldering, helping you achieve flawless results every time. Amaoe SU 3 Bga Stencil-Original
Durability Meets Versatility
This stencil is built to withstand intense use, making it an ideal choice for both beginners and experienced technicians. With precise holes and a sleek finish, it adapts to diverse repair scenarios, saving you time and enhancing efficiency. Amaoe SU 3 Bga Stencil-Original
Why Choose Amaoe SU 3?
The Amaoe SU 3 stands out for its original, high-quality construction and user-friendly design, enabling hassle-free BGA chip alignment. Perfect for tackling complex repair projects with ease, it’s a must-have for those aiming for consistent excellence. Amaoe SU 3 Bga Stencil-Original
The Amaoe SU-3 BGA Reballing Stencil is a premium-tier maintenance tool specifically engineered for the high-precision reballing of Spreadtrum (Unisoc) CPU architectures. In the world of micro-soldering, Amaoe is widely regarded for its “Square-Round” hole design, which prevents solder paste from sticking and ensures uniform ball formation. Amaoe SU 3 Bga Stencil-Original
Below are the comprehensive specifications, technical features, and compatibility details for the Amaoe SU-3. Amaoe SU 3 Bga Stencil-Original
🛠️ Technical Specifications Table
| Feature | Specification Details |
| Brand | Amaoe (Authentic Original) |
| Model Number | SU-3 (Spreadtrum Series) |
| Material | High-Grade Japanese Imported Steel (Stainless) |
| Stencil Thickness | 0.12 mm (Standard High-Precision) |
| Manufacturing Process | High-speed Laser Cutting / Chemical Etching |
| Hole Design | Square-Round (Tapered) for easy release |
| Alignment Accuracy | ±0.01 mm |
| Heat Resistance | Up to 450°C (Anti-warping/Anti-bulge) |
| Weight | Approximately 20g |
| Dimensions | Approx. 10 cm x 8 cm |
| Reusability | High (Multi-cycle durability) |
📱 Supported Chipsets & Compatibility
The SU-3 is a specialized stencil. Unlike universal stencils, it features dedicated layouts for specific Spreadtrum ICs often found in budget and mid-range Android devices, tablets, and IoT hardware.
Primary CPU/SoC Support:
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SC9863A: Octa-core processor commonly used in budget tablets.
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SC9832E: Popular 4G LTE chipset for entry-level smartphones.
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SC2721G: Power Management / Baseband IC.
Integrated IC Layouts:
The SU-3 also includes specific grids for peripheral and supporting chips:
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BGA254: Standardized grid for various Spreadtrum memory/processor combos.
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RPM6743-31: RF / Power Amplifier module.
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SR3595D / SR3593A: Radio Frequency (RF) Transceivers.
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RTM7916-51: Front-end module for mobile networking.
🌟 Key Performance Features
1. Anti-Bulge Technology
One of the most common issues in reballing is the stencil “bowing” or bulging when heat is applied. The Amaoe SU-3 is manufactured with specialized tension-relief zones and high-thermal-stability steel to ensure it remains perfectly flat against the chip during the heating process.
2. Precise Pin Location
The apertures are laser-cut to match the exact pitch and diameter of Spreadtrum’s BGA pads. This precision minimizes the risk of solder bridging (short circuits) or voiding (weak connections), which are the primary causes of motherboard failure after a CPU transplant.
3. Optimized Solder Paste Release
The “Square-Round” hole design means the top of the hole is slightly wider than the bottom. This allows the solder paste to release cleanly when you lift the stencil, ensuring that every ball is the exact same height and volume.
💡 Professional Usage Tips
To get the most out of your Amaoe SU-3 stencil, follow these best practices:
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Cleaning: Always clean the stencil with Mechanic 560 or 99% Isopropyl Alcohol (IPA) after every use to prevent dried flux from clogging the micro-apertures.
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Paste Application: Use a high-quality solder paste (e.g., 183°C or 138°C depending on the chip’s thermal sensitivity). Apply with a flat scraper at a 45° angle.
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Heat Control: Use a high-quality hot air station (like a Quick 861DW). Set the airflow to a medium-low setting to prevent the solder balls from blowing away before they melt.
Note: The SU-3 is part of a 3-piece set (SU-1, SU-2, SU-3). While the SU-3 focuses on newer SC98xx series chips, you may need the SU-1 or SU-2 for older legacy Spreadtrum processors.
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