Amaoe U-HIU1 BGA Reballing Stencil-Original
High-Precision Stencil for Reballing Tasks
The Amaoe U-HIU1 BGA Reballing Stencil-Original is the perfect tool for intricate rework and chip-level repair operations. Designed with precision in mind, this stencil ensures seamless alignment and a professional finish for BGA chip reballing projects. Amaoe U-HIU1 BGA Reballing Stencil-Original
Durable & Reliable Material
Built using high-quality materials, the Amaoe U-HIU1 offers outstanding durability and longevity. Its advanced engineering ensures consistency in performance, even after prolonged use, making it a top choice for technicians and DIY enthusiasts alike. Amaoe U-HIU1 BGA Reballing Stencil-Original
Perfect for Professional Use
Whether you’re working on delicate electronics or large-scale repair projects, this stencil offers exceptional accuracy and ease of use. Its user-friendly design reduces errors, saving time and effort while delivering professional-grade results every time. Amaoe U-HIU1 BGA Reballing Stencil-Original
The Amaoe U-HIU1 is a specialized high-precision BGA reballing stencil designed specifically for the Huawei/HiSilicon ecosystem. It is part of Amaoe’s “Hi-CPU” series, which focuses on providing a comprehensive solution for Huawei’s Kirin chipsets and their accompanying RAM modules. Amaoe U-HIU1 BGA Reballing Stencil-Original
In the world of micro-soldering, Amaoe is widely regarded for its “square hole” design, which prevents solder balls from getting stuck—a common frustration with cheaper circular-hole alternatives. Amaoe U-HIU1 BGA Reballing Stencil-Original
Technical Specifications: Amaoe U-HIU1
| Feature | Specification |
| Model Number | U-HIU1 (Hi-CPU Series) |
| Material | High-hardness Japanese Stainless Steel |
| Thickness | 0.12mm |
| Hole Type | Precision Square Apertures |
| Compatibility | Huawei HiSilicon Kirin Series (710, 810, 820, 960) |
| Supported ICs | CPU and LPDDR RAM (Upper/Lower Layers) |
| Anti-Warping | High-temperature resistance (Thermal Stress Relief) |
| Finish | Laser-cut, CNC-polished edges |
Detailed Component Support
The U-HIU1 is a “Multi-in-One” template. Instead of buying a separate stencil for every Huawei phone, this single sheet covers the most critical chips found in mid-range and flagship Huawei and Honor devices. Amaoe U-HIU1 BGA Reballing Stencil-Original
1. Supported CPU Chipsets
The stencil features dedicated layouts for the following HiSilicon processors:
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Kirin 820 (Hi6290/L V1): Found in devices like the Huawei P40 Lite 5G and Honor 30S.
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Kirin 960 (Hi3660): The flagship chip for the Mate 9 and P10 series.
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Kirin 810 (Hi6280): Powering the popular Nova 5 and Honor 9X Pro.
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Kirin 710 / 710F (Hi6260 V100/V101): The workhorse for dozens of Honor and Nova budget models.
2. Supported RAM Modules
Because these are “Package on Package” (PoP) designs, the U-HIU1 includes the layouts for the RAM that sits directly on top of the CPU:
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Hi3660 RAM (for Kirin 960)
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Hi6260 V100 RAM (for Kirin 710)
Key Features & Professional Advantages
1. 0.12mm Thickness Balance
The thickness of a stencil is critical. At 0.12mm, the U-HIU1 is thick enough to resist warping under the heat of a hot air station, yet thin enough to allow the solder paste to form perfectly sized balls. If a stencil is too thin, it buckles; if it’s too thick, the solder balls become too large and cause shorts (bridging). Amaoe U-HIU1 BGA Reballing Stencil-Original
2. The “Square Hole” Innovation
Most entry-level stencils use round holes. Amaoe uses square apertures with a slight taper. This design ensures that when the solder melts and forms a sphere, it naturally “pops” out of the cornered edges rather than sticking to the walls of a round hole. Amaoe U-HIU1 BGA Reballing Stencil-Original
3. High-Grade Japanese Steel
The steel used in the U-HIU1 is specifically sourced for its thermal expansion properties. During the reballing process, you apply heat roughly between 300°C and 350°C. Amaoe stencils are designed to expand uniformly, reducing the risk of the “bulge” that ruins a reballing attempt mid-way. Amaoe U-HIU1 BGA Reballing Stencil-Original
4. Precision Alignment
The apertures are laser-cut with a tolerance of microns. This is essential for Kirin CPUs, which have incredibly high pin counts and narrow pitches. The U-HIU1 ensures that every solder ball lands exactly on the copper pad of the IC. Amaoe U-HIU1 BGA Reballing Stencil-Original
Usage Recommendations
To get the most out of the Amaoe U-HIU1, technicians should follow these professional standards:
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Solder Paste: Use a high-quality 183°C (leaded) or 217°C (lead-free) solder paste. Ensure the paste is slightly “dry” for the best results with 0.12mm stencils.
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Cleaning: Clean the stencil immediately after use with 99% Isopropyl Alcohol (IPA) and a soft-bristled ESD brush. Dried solder paste in the square holes is significantly harder to remove later.
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Stencil Fixation: While many use magnetic reballing stations, the U-HIU1 is designed to work perfectly with high-temperature Kapton tape to secure the chip to the back of the stencil.
Why Choose U-HIU1 Over Universal Stencils?
While “Universal” stencils exist (with rows of dots in various pitches), they are notoriously difficult to use for modern CPUs. A dedicated stencil like the U-HIU1 matches the exact pinout of the Kirin chip, including the blank spaces where no pins exist. This prevents “stray” solder balls from forming on the IC, which can cause height imbalances and lead to a “cold solder” joint when the chip is mounted back onto the motherboard.
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