Amaoe U-HIU2 BGA Reballing Stencil-Original
Unmatched Precision for BGA Reballing
The Amaoe U-HIU2 BGA Reballing Stencil-Original is expertly designed to cater to technicians and electronics enthusiasts demanding high precision. Engineered from durable material, this stencil ensures an exact fit for your BGA rework needs, minimizing errors and delivering professional-grade results every time. Amaoe U-HIU2 BGA Reballing Stencil-Original
Durable and Easy to Use
Crafted for repetitive use, the U-HIU2 stencil is both durable and user-friendly. Its robust build eliminates warping or unnecessary wear, enabling steadier performance during sensitive reballing tasks. No matter your expertise level, it offers an intuitive experience that saves both time and effort. Amaoe U-HIU2 BGA Reballing Stencil-Original
Compatible with Industry Standards
Designed to sync seamlessly with industry-standard soldering requirements, this reballing stencil ensures compatibility with a variety of BGA chip sizes. Its versatility makes it an essential tool for repair professionals and hobbyists striving for efficiency and reliability in their projects. Amaoe U-HIU2 BGA Reballing Stencil-Original
The Amaoe U-HIU2 BGA Reballing Stencil is a professional-grade precision tool specifically engineered for high-end Huawei smartphone repairs. As part of the Amaoe “Universal” (U-series) lineup, it focuses on the HiSilicon Kirin series chipsets, providing a dedicated platform for reballing both the CPU and its corresponding RAM chips. Amaoe U-HIU2 BGA Reballing Stencil-Original
The U-HIU2 is widely recognized for its high-temperature resistance and precise square-hole alignment, which prevents solder bridging—a common failure point in micro-soldering. Amaoe U-HIU2 BGA Reballing Stencil-Original
Technical Specifications: Amaoe U-HIU2
| Specification | Details |
| Product Model | Amaoe U-HIU2 |
| Material | Japanese Imported High-Grade Stainless Steel (304/Hardened) |
| Stencil Thickness | 0.12 mm (Precision Standard) |
| Hole Type | Square Apertures (Laser-cut for better paste release) |
| Heat Resistance | Up to 450°C (Anti-bulge / Anti-deformation) |
| Compatible Brand | Huawei / HiSilicon |
| Function | BGA IC Reballing, CPU & RAM Solder Ball Positioning |
| Finish | Matte/Polish (Reduced glare for microscope work) |
| Physical Dimensions | Approximately 100 mm x 90 mm |
Supported ICs & Chipsets
The U-HIU2 is a “multi-in-one” stencil, meaning it contains dedicated patterns for several generations of Huawei’s flagship processors. This makes it a versatile asset for technicians handling models from the Mate 20 series through the Mate 40 and P-series flagships. Amaoe U-HIU2 BGA Reballing Stencil-Original
Kirin Processors Supported:
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Kirin 9000 (Hi36A0): Used in Mate 40 Pro and P50 series.
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Kirin 990 (Hi3690 4G/5G): Used in Mate 30 and P40 series.
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Kirin 980 (Hi3680): Used in P30 and Mate 20 series.
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Kirin 970 (Hi3670): Used in P20 and Mate 10 series.
Auxiliary ICs Supported:
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RAM 376: Memory chips paired with Hi36A0.
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Hi9500 V1: Power management or RF-related controller.
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Hi36A0 RAM: Dedicated pattern for the Kirin 9000 memory layer.
Design Features and Advantages
The Amaoe U-HIU2 distinguishes itself through several manufacturing choices that cater to the difficulty of modern Ball Grid Array (BGA) repair: Amaoe U-HIU2 BGA Reballing Stencil-Original
1. Precision Laser Cutting
Unlike cheaper stamped stencils, the U-HIU2 uses laser-cutting technology to create square apertures. These holes are slightly tapered, being wider at the bottom than the top. This geometry ensures that once the solder paste is heated and turns into a ball, the stencil can be lifted easily without “pulling” the balls out of their positions. Amaoe U-HIU2 BGA Reballing Stencil-Original
2. Heat Sink and Stress Relief
High-temperature reballing can cause thin steel to “bulge” or warp. Amaoe utilizes a specific grade of Japanese steel that maintains flatness even under the direct heat of a hot air station (usually around 330°C to 380°C for lead-free solder). Amaoe U-HIU2 BGA Reballing Stencil-Original
3. Alignment Accuracy
The layout of the U-HIU2 matches the original manufacturer’s schematics exactly. This is critical for Kirin CPUs, which often feature a “PoP” (Package on Package) design where the RAM sits directly on top of the CPU. The stencil provides the necessary patterns for both the bottom (CPU-to-Motherboard) and top (CPU-to-RAM) connections.
Best Practices for Use
To maximize the lifespan of the U-HIU2 and ensure a successful repair, technicians should follow these operational steps:
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Cleaning: Always clean the stencil with 99% Isopropyl Alcohol (IPA) before and after use to remove dried solder paste residue.
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Paste Application: Use a high-quality solder paste (typically 183°C leaded or 217°C lead-free). Spread the paste evenly using a spatula, ensuring every square hole is filled.
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Heat Management: When heating, start with a low airflow setting to prevent the paste from “jumping” out of the holes. Move the nozzle in a circular motion to distribute heat evenly.
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Storage: Keep the stencil in its original packaging or a flat folder. Bending the 0.12 mm steel even slightly can ruin the alignment for future repairs.
Note: The U-HIU2 is part of an iterative series. For older Kirin chips (like Kirin 650 or 710), technicians usually look toward the U-HIS1 or U-HIS2 models, whereas the U-HIU2 is the standard for modern, high-performance Huawei devices.
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