Amaoe U-MTK3 Stencil-Original
High-Precision for Seamless Repairs
The Amaoe U-MTK3 Stencil-Original offers unmatched precision for complex electronic repair tasks. Designed for professional technicians, this stencil ensures an exact alignment, delivering flawless results and saving valuable time during intricate repair procedures. Amaoe U-MTK3 Stencil-Original
Durable Build for Long-Term Use
Engineered from top-quality materials, the Amaoe U-MTK3 is designed to withstand daily use and retain its form for extended periods. Its robust construction makes it a reliable tool suitable for heavy-duty repair projects. Amaoe U-MTK3 Stencil-Original
Compatible and Versatile
This stencil seamlessly adapts to a wide range of devices, making it an essential addition to any repair kit. Ideal for micro-soldering and other precision tasks, the Amaoe U-MTK3 caters to all your technical needs. Amaoe U-MTK3 Stencil-Original
The Amaoe U-MTK3 is a professional-grade BGA (Ball Grid Array) reballing stencil specifically engineered for MediaTek (MTK) integrated circuits. It is part of the “U-Series” (Universal/Ultra-hard) known for high thermal stability and precision-cut square holes that prevent solder paste from sticking or forming irregular balls. Amaoe U-MTK3 Stencil-Original
Below are the comprehensive technical specifications and compatibility details for the original Amaoe U-MTK3. Amaoe U-MTK3 Stencil-Original
Technical Specifications Table
| Feature | Specification Details |
| Brand | Amaoe (Original) |
| Model Series | U-MTK Series (specifically U-MTK3) |
| Material | High-quality Japanese Imported Steel Sheet |
| Hardness Grade | Super Hard / High Elasticity |
| Thickness | 0.12 mm |
| Aperture Type | Precision Square Hole (CNC Laser Cut) |
| Heat Resistance | High Thermal Stability (Resists warping under hot air) |
| Net Weight | Approx. 0.02 kg |
| Reusability | High (Multi-use industrial grade) |
| Application | MTK CPU, RAM, and Power IC Reballing |
Supported IC & Chipsets
The U-MTK3 is a “multi-in-one” comprehensive stencil. It is specifically designed to cover the following MediaTek chips and BGA layouts:
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CPUs & Integrated ICs: * MT6350V
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MT6356W
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MT6357V (Common in mid-range Android devices)
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MT6351DV
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MT6176V
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Universal BGA Layouts: * BGA254 (Commonly used for EMMC/UFS memory chips paired with MTK chipsets)
Key Features & Build Quality
1. High-Quality Japanese Steel
Unlike generic stencils that use standard stainless steel, the Amaoe U-MTK3 utilizes imported Japanese steel. This material is chosen for its “memory” properties—it can withstand the high temperatures of a hot air gun (typically 300°C to 380°C during reballing) without permanently warping or bowing. Amaoe U-MTK3 Stencil-Original
2. Square Hole Technology
The stencil features square-shaped apertures rather than traditional circular ones.
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Benefit: Square holes allow for a more consistent volume of solder paste to be deposited.
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Solder Release: The slightly tapered walls of the square cuts ensure that when you lift the stencil after applying the paste, the “solder bricks” stay on the PCB instead of sticking to the stencil.
3. 0.12mm Optimal Thickness
The 0.12 mm thickness is the industry standard for modern smartphone ICs. It provides the perfect balance: thick enough to provide structural integrity during the scraping process, but thin enough to prevent “solder bridging” (where balls merge together because too much paste was applied). Amaoe U-MTK3 Stencil-Original
Practical Usage Guidelines
To maximize the lifespan of your Amaoe U-MTK3 stencil and ensure a successful reball, follow these professional steps:
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Preparation: Clean the IC and the stencil thoroughly using 99% Isopropyl Alcohol (IPA). Any leftover flux or old solder will prevent the stencil from sitting flush.
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Alignment: Align the square holes with the pads on the IC. Use a microscope for high-precision alignment.
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Paste Application: Use a high-quality solder paste (e.g., 183°C or 138°C depending on the chip’s heat sensitivity). Apply a small amount and scrape it across the stencil at a 45-degree angle.
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Heating: Hold the stencil down with tweezers. Use a hot air station with a low airflow setting to prevent the stencil from lifting. Move the nozzle in a circular motion until the balls form.
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Cooling: Allow the stencil to cool naturally for a few seconds before lifting. Do not force it off while the solder is still molten.
Comparison: U-MTK3 vs. Standard Stencils
| Feature | Amaoe U-Series | Standard Stencils |
| Durability | High (resists “drumming” or bulging) | Moderate (may warp after 5-10 uses) |
| Precision | Laser-cut square holes | Often etched circular holes |
| Solder Ball Shape | Uniform and centered | Can be irregular or offset |
Note: Always ensure you are purchasing the “Original” Amaoe version. Look for the Amaoe holographic branding or the specific “U-MTK3” engraving on the bottom right of the steel sheet to avoid low-quality clones that warp easily. Amaoe U-MTK3 Stencil-Original
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