Amaoe U-MTK8 Reballing Stencil-Original For 7200-Ultra-MT6886V/7300X-MT6878V/6100/MT6835V/MT6781
Amaoe U-MTK8 Reballing Stencil-Original For 7200-Ultra-MT6886V/7300X-MT6878V/6100/MT6835V/MT6781
| Field | Specification |
|---|---|
| Product Name | Amaoe U-MTK8 Reballing Stencil — Original |
| Model / SKU | U-MTK8 |
| Primary Purpose | Precision BGA reballing and solder-paste application for MediaTek SoC families and related ICs. |
| Compatible Chipsets / Devices | MediaTek MT6886V (often marketed as Dimensity/7200-Ultra variants), MT6878V (7300X family), MT6835V, MT6781 and similar MediaTek mobile SoCs/PMICs with matching pad patterns. (Confirm pattern match to your specific board revision before use.) |
| Stencil Type | BGA / SMT reballing stencil — middle/final layer template for solder ball placement or paste deposition. |
| Material | High-grade stainless steel (precision laser or chemical etched). |
| Typical Thickness Options | 0.10 mm / 0.12 mm / 0.15 mm available (0.12 mm is most common for mobile SoC reballing; confirm when ordering). |
| Aperture Geometry | Square / rounded square apertures (designed to match ball pad geometry and reduce bridging). |
| Aperture Size / Ball Recommendation | Aperture sizes tailored to pad diameters of the listed SoCs; recommended solder ball diameter typically ranges from 0.30 mm to 0.45 mm depending on pad pitch — verify with the pad measurement. |
| Positional Accuracy / Tolerance | High-precision etch with micron-level positional tolerance (manufacturer spec; typical tolerance ±5–15 µm). |
| Surface Finish | Smooth, matte/anti-glare finish to improve visibility and reduce solder sticking. |
| Planarity / Flatness | Manufactured to maintain high planarity (≤0.05 mm deviation across usable area recommended). Use a frame/jig to improve contact. |
| Edge Treatment | Deburred and polished edges; reinforced frame border on some batches for flatness and handling. |
| Included Items (Typical) | 1 × U-MTK8 stencil sheet; protective film/sleeve. Some sellers may offer a kit version including alignment plate, magnetic base, and blades. |
| Reusability | Reusable; lifetime depends on handling and cleaning—dozens to hundreds of cycles typical with careful use. |
| Cleaning & Maintenance | Clean with isopropyl alcohol (IPA) and soft brush; ultrasonic cleaning recommended for heavy flux buildup. Avoid abrasive scrubbing that deforms apertures. |
| Operating Considerations | Stencil used at room temperature for paste/ball placement. Final reflow profile follows the chosen solder paste (SAC305 or other Pb-free alloys). |
| Storage Recommendations | Store flat in anti-static sleeve, dry environment (20–25°C, <60% RH). Avoid bending, stacking heavy items, or leaving in humid/acidic environments. |
| Handling Precautions | Handle by edges using gloves or tweezers; avoid touching aperture areas; lift straight up after placement to prevent smearing. |
| Packaging | Anti-static protective sleeve / foam backing inside retail box — varies by seller. |
| Manufacturer / Brand | Amaoe (original) |
| Country of Origin | Commonly manufactured in China (Amaoe tooling/spec). |
| Compliance | Typically RoHS friendly (metal material); use with RoHS-compliant solder paste for lead-free reflow. |
| Typical Net Weight & Dimensions | Lightweight (grams); sheet size usually in the general range to cover typical SoC area — exact dimensions depend on variant. |
| Warranty / Returns | Seller/manufacturer dependent — check merchant terms before purchase. |
| Common Accessories (recommended) | Alignment jig/positioning plate, magnetic base, reusable metal frame, squeegee, solder balls/paste, flux applicator, microscope or magnifier. |
| Typical Price Range | Low-cost accessory item; price varies by seller, included accessories, and thickness option. |
| Seller Notes | Always confirm the stencil pattern against the specific PCB revision and SoC package footprint before using. Some SoC family members share footprints; others differ by revision. |
Explanatory Notes, Usage Tips & Best Practices
1. Confirm compatibility first.
Although the U-MTK8 label indicates design for a set of MediaTek SoCs (MT6886V, MT6878V, MT6835V, MT6781 and close cousins), manufacturers sometimes produce multiple PCB revisions or slightly different pad layouts for different device models — visually verify the stencil aperture layout against the actual PCB under magnification before committing. Amaoe U-MTK8 Reballing Stencil-Original For 7200-Ultra-MT6886V/7300X-MT6878V/6100/MT6835V/MT6781
2. Choose thickness for your needs.
Thicker stencils (0.12–0.15 mm) deliver more solder volume and greater rigidity; thinner (0.10 mm) gives finer control for very tight pitches. For most mobile SoC reballing, 0.12 mm is a good balance. Amaoe U-MTK8 Reballing Stencil-Original For 7200-Ultra-MT6886V/7300X-MT6878V/6100/MT6835V/MT6781
3. Solder ball and paste selection.
Match solder ball diameter to aperture/pad geometry. Commonly used solder alloys for mobile SoCs are SAC305 (Sn96.5/Ag3.0/Cu0.5). Use compatible flux — no-clean is common — and clean the board per flux type after reflow if necessary. Amaoe U-MTK8 Reballing Stencil-Original For 7200-Ultra-MT6886V/7300X-MT6878V/6100/MT6835V/MT6781
4. Alignment & fixture use.
Use a positioning plate, magnetic base, or framed jig to hold the stencil flat and aligned. This reduces misalignment and increases first-pass success rate. Amaoe U-MTK8 Reballing Stencil-Original For 7200-Ultra-MT6886V/7300X-MT6878V/6100/MT6835V/MT6781
5. Application technique.
Place the stencil flat on the board, deposit balls or paste, use a squeegee at a shallow angle to remove excess, then lift the stencil straight up (no twist). If using solder balls, use a gentle tamping or vibration to seat them into the apertures. Amaoe U-MTK8 Reballing Stencil-Original For 7200-Ultra-MT6886V/7300X-MT6878V/6100/MT6835V/MT6781
6. Cleaning after use.
Immediately remove flux and solder residues using IPA and a soft brush. For heavy residues, ultrasonic cleaning with an appropriate solvent preserves aperture geometry. Repeated hard cleaning or scraping shortens stencil life. Amaoe U-MTK8 Reballing Stencil-Original For 7200-Ultra-MT6886V/7300X-MT6878V/6100/MT6835V/MT6781
7. Storage & handling.
Store flat in anti-static sleeve; avoid dropping or flexing the sheet. Oils from skin can cause solder to stick — handle with gloves. Amaoe U-MTK8 Reballing Stencil-Original For 7200-Ultra-MT6886V/7300X-MT6878V/6100/MT6835V/MT6781
8. Reuse & lifespan.
With careful handling and cleaning, a high-quality stainless stencil will withstand many cycles. Inspect apertures periodically — distorted apertures cause inconsistent solder deposits. Amaoe U-MTK8 Reballing Stencil-Original For 7200-Ultra-MT6886V/7300X-MT6878V/6100/MT6835V/MT6781
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