KLMAG2GE-AC EMMC BGA 169 Mobile Phone IC
Advanced Storage Performance
The KLMAG2GE-AC EMMC BGA 169 Mobile Phone IC is designed to deliver advanced storage performance, making it an essential component for modern smartphones. Its high-efficiency operations ensure quick data transfers and seamless multitasking, optimizing the overall device experience. KLMAG2GE-AC EMMC BGA 169 Mobile Phone IC
Compact and Durable Design
With its compact BGA 169 design, this IC is engineered for space-saving integration. The build quality ensures reliability and durability, maintaining peak functionality in demanding environments. It’s a trusted choice for manufacturers seeking a dependable storage solution. KLMAG2GE-AC EMMC BGA 169 Mobile Phone IC
Wide Compatibility and Versatility
This eMMC IC is widely compatible with numerous mobile phone models, providing versatile application options. Whether for budget-friendly smartphones or high-end devices, the KLMAG2GE-AC delivers consistent and dependable performance tailored to your needs. KLMAG2GE-AC EMMC BGA 169 Mobile Phone IC
The KLMAG2GEAC-B031 is a high-performance, embedded MultiMediaCard (eMMC) manufactured by Samsung. It is a managed NAND flash memory solution commonly found in premium mobile phones, tablets, and embedded systems. This specific IC follows the eMMC 5.0 standard, utilizing a BGA-169 (169-ball) or BGA-153 package footprint, offering a blend of high density and fast data transfer speeds. KLMAG2GE-AC EMMC BGA 169 Mobile Phone IC
Technical Specifications Table
| Feature | Specification Details |
| Manufacturer | Samsung Electronics |
| Part Number | KLMAG2GEAC-B031 |
| Memory Capacity | 16 GB (128 Gb) |
| Interface Standard | eMMC 5.0 (JEDEC JC-64.1) |
| Data Rate Mode | HS400 (High Speed 400) |
| Bus Width | 1-bit, 4-bit, 8-bit (x8 support) |
| Clock Frequency | 0 to 200 MHz |
| Max Bandwidth | Up to 400 MB/s |
| Sequential Read | ~240 MB/s |
| Sequential Write | ~40 MB/s |
| Random Read (IOPS) | 6,000 IOPS |
| Random Write (IOPS) | 2,500 IOPS |
| Operating Voltage (VCC) | 2.7V to 3.6V (Memory) |
| Interface Voltage (VCCQ) | 1.70V to 1.95V / 2.7V to 3.6V (Dual support) |
| Package Type | FBGA-169 / FBGA-153 |
| Package Dimensions | 11.5mm x 13.0mm x 1.0mm |
| Operating Temp | -25°C to 85°C |
Key Features & Architecture
The KLMAG2GEAC-B031 is built on Samsung’s advanced MLC (Multi-Level Cell) NAND technology. Unlike raw NAND, eMMC integrates the flash memory and the controller into a single package. This architecture simplifies the host software by handling complex tasks like error correction (ECC), wear leveling, and bad block management internally. KLMAG2GE-AC EMMC BGA 169 Mobile Phone IC
Performance Highlights
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HS400 Support: By utilizing the HS400 interface, this IC can reach theoretical transfer rates of 400 MB/s. This is crucial for modern mobile operating systems that require quick boot times and fast application loading.
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Command Queuing: This feature allows the host to send multiple commands to the device, which the controller can then optimize for execution, significantly reducing latency.
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Low Power Consumption: Designed for battery-operated devices, it features “Sleep” and “Standby” modes that consume minimal current when the data bus is idle.
Durability and Reliability
The device includes RPMB (Replay Protected Memory Block) for secure data storage (such as authentication keys) and supports Hardware Reset (H/W Reset) for improved system stability during crashes. Its operating temperature range makes it suitable for both consumer electronics and industrial-grade tablets.
Pinout and Physical Layout
The BGA-169 package refers to the grid of 169 solder balls on the bottom of the chip. While only a portion of these balls are active (the rest are for mechanical stability or heat dissipation), the layout is standardized to allow manufacturers to swap chips from different vendors easily.
Common Signal Assignments
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DAT[0-7]: The 8-bit bidirectional data bus.
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CMD: Command/Response line for communicating with the host.
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CLK: Clock signal provided by the host.
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RST_n: Hardware reset signal.
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VCC/VCCQ: Power rails for the NAND and the I/O interface respectively.
Application and Use Cases
Due to its 16GB capacity and eMMC 5.0 speed, this IC was a staple in the mid-to-high-tier smartphone market. Today, it remains highly popular in:
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Industrial PCs: For reliable booting and OS storage.
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IoT Gateways: Where high-speed data logging is required.
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Automotive Infotainment: Providing storage for maps and multimedia in vehicles.
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Repair/Refurbishment: Used as a replacement part for damaged storage in older smartphone models.
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