KMV 3W000LM-B310 EMMC BGA 153 Mobile Phone IC
Enhance Your Mobile Devices with KMV 3W000LM-B310
The KMV 3W000LM-B310 EMMC BGA 153 Mobile Phone IC is designed to elevate the performance of your devices. Its robust and reliable architecture ensures optimal data management and storage for modern mobile applications. KMV 3W000LM-B310 EMMC BGA 153 Mobile Phone IC
Advanced Technology for Seamless Functionality
This EMMC (Embedded MultiMediaCard) chip offers efficient data transfer speeds and exceptional storage capabilities, making it an ideal choice for meeting the demands of high-performance smartphones and tablets. KMV 3W000LM-B310 EMMC BGA 153 Mobile Phone IC
Dependable Performance You Can Trust
Built with precision and advanced engineering, the KMV 3W000LM-B310 EMMC BGA 153 IC guarantees enduring performance and compatibility, ensuring your devices deliver a seamless user experience. KMV 3W000LM-B310 EMMC BGA 153 Mobile Phone IC
The KMV3W000LM-B310 is a high-performance integrated circuit (IC) primarily used in mobile devices, most notably as the core storage module for the Samsung Galaxy S4 (I9500). It is technically classified as an eMCP (Embedded Multi-Chip Package), which combines eMMC storage and Mobile DDR (LPDDR) RAM into a single, compact BGA package to save space on the smartphone’s logic board. KMV 3W000LM-B310 EMMC BGA 153 Mobile Phone IC
Below are the detailed specifications and technical parameters for this component. KMV 3W000LM-B310 EMMC BGA 153 Mobile Phone IC
Technical Specifications Table
| Feature | Specification Details |
| Manufacturer | Samsung Electronics |
| Part Number | KMV3W000LM-B310 |
| Component Type | eMCP (eMMC + LPDDR2/3) |
| Package Type | FBGA-153 (153-ball Grid Array) |
| Storage Capacity | 16 GB (eMMC) |
| RAM Capacity | 512 MB (Mobile DDR SDRAM) |
| Standard Compliance | eMMC 4.5 Interface |
| Operating Voltage (VCC) | 2.7V – 3.6V |
| I/O Voltage (VCCQ) | 1.70V – 1.95V / 2.7V – 3.6V |
| Operating Temperature | -25°C to +85°C (Standard Mobile Grade) |
| Application | Smartphones, Tablets, Embedded Systems |
| Physical Dimensions | Approx. 11.5mm x 13.0mm x 1.0mm |
Key Features & Architecture
1. Integrated Dual-Functionality
Unlike a standard eMMC chip which only provides storage, the KMV3W000LM-B310 utilizes Multi-Chip Package (MCP) technology. By stacking NAND flash memory and a DRAM controller in one 153-ball housing, it reduces the PCB footprint by nearly 40% compared to using discrete components.
2. High-Speed Data Interface
The IC follows the eMMC 4.5 protocol, which was a significant jump for its era. It supports:
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HS200 Mode: Allowing for data transfer speeds up to 200 MB/s.
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Reliability: Features like “High Priority Interrupt” and “Packed Commands” to ensure the operating system (Android) remains responsive even during heavy background write operations.
3. Durability and Security
Samsung engineered this IC with mobile-grade durability in mind. It includes:
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Bad Block Management: Internal controllers automatically map out failing sectors to extend the chip’s lifespan. KMV 3W000LM-B310 EMMC BGA 153 Mobile Phone IC
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Secure Erase/Trim: Essential for maintaining write speeds over years of usage. KMV 3W000LM-B310 EMMC BGA 153 Mobile Phone IC
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Error Correction (ECC): Integrated hardware ECC to prevent data corruption during high-speed reads. KMV 3W000LM-B310 EMMC BGA 153 Mobile Phone IC
Technical Considerations for Repair & Installation
The BGA-153 footprint means there are 153 tiny solder balls on the underside of the chip. Replacing this IC requires professional SMD Rework equipment.
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Stencil Requirements: Technicians must use a dedicated BGA-153 / BGA-169 universal stencil for “reballing” the chip if it is being moved from a donor board. KMV 3W000LM-B310 EMMC BGA 153 Mobile Phone IC
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Heat Profile: Because it contains both NAND and DRAM, excessive heat during the soldering process (exceeding 260°C for too long) can lead to “internal popping” or delamination of the layers. KMV 3W000LM-B310 EMMC BGA 153 Mobile Phone IC
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Firmware/CID: This chip is often “locked” to specific device firmware. When replacing it, the CID (Card Identification) may need to be programmed using a specialized box (like EasyJTAG or UFI Box) to ensure the device’s CPU recognizes the new storage. KMV 3W000LM-B310 EMMC BGA 153 Mobile Phone IC
Common Failure Symptoms
When this IC begins to fail in a mobile device, users typically experience:
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“Encryption Unsuccessful” errors on boot. KMV 3W000LM-B310 EMMC BGA 153 Mobile Phone IC
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The device getting stuck on the logo (Bootloop).
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Inability to wipe data or “Read Only” file system errors.
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