Mobile Phone IC For PM8150 Original
The Qualcomm PM8150 is a flagship Power Management Integrated Circuit (PMIC) designed to support the Snapdragon 855 and 855+ mobile platforms. It is the primary power hub for a device, coordinating energy distribution for high-performance components like the CPU, GPU, and RAM.
The PM8150 is often part of a complex “multi-PMIC” architecture where it works in tandem with companion chips like the PM8150B (for charging) and PM8150L (for display and peripherals) to optimize thermal efficiency and battery life.
PM8150 Original Technical Specifications
The table below details the original specifications, operational limits, and physical characteristics of the PM8150.
| Feature / Parameter | Specification |
| Manufacturer | Qualcomm Technologies, Inc. |
| Model | PM8150 (Primary Core PMIC) |
| Package Type | 161-pin FOWPSP (Fan-Out Wafer-Level Picoscale Package) |
| Dimensions | 4.49 mm x 5.07 mm x 0.55 mm |
| Voltage Rails | 28 programmable outputs (Total) |
| Buck Converters | 2 HFS510 (High-Frequency) + 8 FTS510 (Fast-Transient) |
| LDO Regulators | 18 LDO linear regulators (Pseudo-capless design) |
| Communication | SPMI (System Power Management Interface) |
| Clock Support | 38.4 MHz XO controller + 6 clock outputs |
| Thermal Range | -40°C to +125°C (Operational) |
| Protection | Multistage Smart Thermal Control (Stage 0–3 shutdown) |
| I/O Support | 10 GPIOs (Configurable for analog/digital/pass-through) |
Key Functional Blocks
The PM8150 is much more than a voltage regulator; it handles essential “housekeeping” tasks required for a device to boot and stay stable.
1. High-Performance Power Delivery
The IC uses FTS510 Buck Converters, which are specifically optimized for the rapid current changes required by modern CPUs and GPUs. These converters can adjust voltage levels in microseconds, allowing the processor to scale power consumption instantly based on performance needs.
2. Advanced Clock Management
The PM8150 includes a 38.4 MHz Crystal Oscillator (XO) controller. It generates:
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Three RF clock outputs for the modem and radio frequency circuits.
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Three baseband clock outputs for the main SoC.
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Sleep Clock: A 32.768 kHz signal derived from the 38.4 MHz source, used to maintain system timing in low-power modes.
3. Thermal Protection Stages
To prevent physical damage to the motherboard, the PM8150 monitors its internal die temperature and reacts in four distinct stages:
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Stage 1 (95°C): Sends an interrupt signal to the SoC to trigger software-level cooling.
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Stage 2 (115°C): Increases interrupt urgency.
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Stage 3 (>145°C): Executes an emergency Hardware Shutdown to protect the silicon.
4. Integrated ADC
The on-chip Analog-to-Digital Converter (ADC) allows the system to monitor critical analog inputs, such as battery voltage, thermistor readings (XO_THERM), and internal power rail health.
Application and Device Compatibility
The PM8150 series is found in nearly all flagship Android devices released between 2018 and 2021.
