PM 7350 Mobile Phone IC
Compact and High-Performance IC
The PM 7350 Mobile Phone IC is engineered to deliver efficient performance in compact devices. Designed with precision, this IC ensures seamless integration into mobile systems without compromising quality or functionality. PM 7350 Mobile Phone IC
Optimize Battery Life and Performance
Built to meet the demands of modern-day devices, the PM 7350 is tailored to enhance battery lifespan while managing power delivery effectively. Its advanced design guarantees stable and reliable performance, even during intensive operations. PM 7350 Mobile Phone IC
Wide Compatibility and Easy Integration
This mobile IC is compatible with a variety of smartphone models, offering a versatile solution for manufacturers and developers alike. The PM 7350 is designed for easy integration, making it a top choice for projects requiring high-quality power management solutions. PM 7350 Mobile Phone IC
The PM7350 (specifically the PM7350C-002) is a high-performance Power Management Integrated Circuit (PMIC) developed by Qualcomm. It is primarily designed to accompany the Snapdragon 778G and 780G 5G chipsets, serving as a “companion” PMIC to handle specialized power rails for the camera, display, and high-speed interfaces. PM 7350 Mobile Phone IC
Unlike a primary PMIC that manages the entire phone’s boot sequence, the PM7350 focuses on high-efficiency voltage regulation for peripheral systems, ensuring that power-heavy components like 120Hz displays or high-resolution camera sensors don’t drain the battery prematurely. PM 7350 Mobile Phone IC
PM7350 Full Technical Specifications
The following table outlines the hardware architecture and electrical parameters of the PM7350C variant commonly found in modern smartphones. PM 7350 Mobile Phone IC
| Feature | Specification Details |
| Manufacturer | Qualcomm Technologies, Inc. |
| Part Number | PM7350C / PM7350C-002 |
| Type | Companion Power Management IC (PMIC) |
| Package Type | 143-pin FOWNSP (Fan-Out Wafer Level Nano-Scale) |
| Package Dimensions | 4.82 mm × 5.16 mm × 0.57 mm |
| SMPS Regulators | 9 Fast Transient Switch Mode Power Supplies (SMPS) |
| LDO Regulators | 13 Low-Dropout (LDO) linear regulators |
| Auxiliary Rails | 1 System rail Buck-or-Boost (BoB) regulator |
| Input Voltage Range | 2.5V to 5.5V |
| Output Current | Up to 3.5A per rail (High-power rails) |
| Interface | SPMI (System Power Management Interface) |
| Connectivity Pins | 9 Programmable GPIOs |
| Thermal Management | Integrated Over Temperature Protection (OTP) |
| Specialized Drivers | RGB LED drivers & Camera Flash/Torch drivers |
Key Functional Highlights
1. Power Efficiency and Regulation
The PM7350 is notable for its Buck-or-Boost (BoB) regulator. In mobile devices, as the battery voltage drops, a standard “Buck” regulator might fail to maintain a steady 3.3V or 5V rail. The BoB architecture allows the PM7350 to seamlessly switch between stepping down (Buck) and stepping up (Boost) the voltage, ensuring stable performance even when the battery is near 5%.
2. High-Speed Transient Response
Modern processors change their power demands in microseconds (e.g., when you suddenly open a heavy app). The PM7350 features nine fast transient SMPS. These are designed to react instantly to current spikes, preventing “voltage sag” which causes system crashes or lag.
3. Integrated Peripheral Support
Beyond simple power, this IC acts as a hub for:
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Camera Support: Provides the high current needed for dual or triple LED flashes.
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Haptics & UI: Manages the power for vibration motors and RGB notification LEDs.
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Housekeeping: Includes internal ADCs (Analog-to-Digital Converters) to monitor system health and temperatures.
Device Compatibility
The PM7350 is a staple in mid-to-high-range “Performance” smartphones. If you are a repair technician or an engineer, you will most commonly find this chip in devices utilizing the Snapdragon 700 series platforms.
| Brand | Notable Models Using PM7350 |
| Samsung | Galaxy A52s 5G, Galaxy M52 5G, Galaxy A73 5G |
| Xiaomi | Mi 11 Lite 5G, Mi 12 Lite, Poco X5 Pro |
| Motorola | Edge 20, Edge 30 |
| Realme | Realme GT Master Edition |
| Huawei/Honor | Honor 50, Honor 60 |
Troubleshooting & Common Symptoms
When this IC fails, the phone typically exhibits specific “power-loop” or peripheral failures. Because it manages the camera and display rails, a faulty PM7350 might cause:
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Dead Phone (No Power): If a short-circuit occurs on a primary SMPS rail.
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No Display/Backlight: If the LDOs powering the display panel fail.
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Camera App Crashes: If the IC cannot provide enough current for the sensor initialization.
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Overheating: If the internal thermal protection fails, the chip may get excessively hot to the touch during charging.
[!IMPORTANT]
Technical Note: Replacing this IC requires advanced BGA (Ball Grid Array) micro-soldering skills. The 143-pin FOWNSP package has a pitch of only 0.40 mm, making it highly sensitive to heat and alignment errors during installation.
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