PM 8350C-004 Mobile Phone IC

Original price was: ₹1,000.00.Current price is: ₹269.00.

PM 8350C-004 Mobile Phone IC

Optimize Your Mobile Device Performance

The PM 8350C-004 Mobile Phone IC is designed to enhance your device’s performance, delivering seamless efficiency and reliability in a compact and powerful package. Built to meet the modern demands of mobile technology, this IC is the perfect solution for robust functionality. PM 8350C-004 Mobile Phone IC

Unparalleled Compatibility and Durability

This mobile phone IC integrates effortlessly with a wide range of mobile devices, providing consistent performance over time. Its durable design ensures longevity, while its advanced features make it a standout choice for tech enthusiasts and professionals alike. PM 8350C-004 Mobile Phone IC

Engineered for Peak Efficiency

The PM 8350C-004 is engineered with precision to optimize energy consumption and heat management. Whether you’re a hardware developer or a mobile device user, this IC delivers maximum efficiency, ensuring your device stays ahead of the curve. PM 8350C-004 Mobile Phone IC

The PM8350C-004 is a high-performance Power Management Integrated Circuit (PMIC) developed by Qualcomm. It is a critical component in the flagship “Power Tree” architecture, specifically designed to support the Snapdragon 888 and Snapdragon 8 Gen 1 series. In modern multi-PMIC designs, the PM8350C often serves as a “companion” or secondary PMU, focusing on specialized tasks like display power, camera flash, and auxiliary voltage rails. PM 8350C-004 Mobile Phone IC

 

PM8350C-004 Full Specifications Table

Feature Category Technical Specification Detail
Manufacturer Qualcomm
Model Number PM8350C-004 (Companion PMIC)
Associated Processor Snapdragon 888 / 888+ / 8 Gen 1
Package Type WLCSP (Wafer Level Chip Scale Package)
BGA Ball Count 128-Ball (Standard for 8k series companions)
Input Voltage $3.4\text{V}$ to $4.8\text{V}$ (System VPH_PWR)
Output Channels 6-8 Buck Converters / 15+ LDOs
Interface SPMI (System Power Management Interface)
Charging Logic Supports Quick Charge 5.0 / PD 3.0
Thermal Protection Integrated Thermal Shutdown at $125^\circ\text{C}$
Key Functions Display Bias, Flash LED, RF Front-End Power
Compatible Models Xiaomi 11/12, Samsung S21/S22, OnePlus 9/10 Pro

Functional Depth and System Role

The PM8350C is part of a complex ecosystem. Unlike older phones that had one power IC, flagship devices split the workload. The “Primary” PM8350 handles the CPU core, while the PM8350C handles the peripheral high-drain components. PM 8350C-004 Mobile Phone IC

1. Display and Visual Power

In flagship devices with AMOLED 120Hz screens, the power requirements are immense. The PM8350C is often responsible for the Display Bias voltages ($V_{pos}$ and $V_{neg}$). If this IC fails, the phone may vibrate and boot, but the screen will remain completely black, or you might see “flickering” at high brightness levels. PM 8350C-004 Mobile Phone IC

2. Advanced Charging Integration

The PM8350C-004 version is specifically optimized for dual-cell battery configurations. It works in tandem with the SMB charging IC to balance the current flowing into the battery. It supports Qualcomm’s Quick Charge 5, which allows for speeds exceeding $100\text{W}$ by managing heat across the PCB through “Parallel Charging” logic.

3. High-Efficiency Buck Regulators

The IC contains synchronized buck converters that operate at high frequencies (up to $4\text{ MHz}$). This allows for the use of tiny, low-profile inductors on the motherboard, saving precious space. These bucks provide the stable $1.2\text{V}$ or $1.8\text{V}$ required for the high-speed LPDDR5 RAM and the UFS 3.1 storage modules.


Repair and Troubleshooting Guide

For mobile technicians, the PM8350C is a “common suspect” in high-end phone repairs.

 

  • Failure Symptoms: If the PM8350C is damaged, the device may show a “0.010A to 0.050A” current draw on a DC Power Supply (a sign of a failed boot sequence). Other symptoms include the Flash LED not working or the phone failing to enter “Fast Charge” mode.

  • The “004” Suffix: The suffix -004 indicates the firmware revision. While some technicians claim that PM8350C-001 and 004 are interchangeable, it is highly recommended to match the exact number. Using the wrong revision can lead to “Camera Failed” errors or “Temperature Too Low” warnings during charging.

  • Soldering Warning: Because this is a WLCSP chip (silicon die with no plastic casing), it is extremely sensitive to heat. Excessive air pressure during desoldering can “pop” the chip or cause internal micro-cracks. A pre-heating temperature of 220°C and a reflow peak of 320°C is usually the industry standard for this specific BGA.

Summary

The PM8350C-004 is a masterpiece of power engineering. It ensures that your high-refresh-rate screen, 108MP camera flash, and 100W charging all work simultaneously without melting the motherboard. When sourcing a replacement, always ensure it is a “New Original” chip to maintain the strict voltage tolerances required by flagship Snapdragon processors.

PM 8350C-004 Mobile Phone IC

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Weight 0.05 kg
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