PM 8926 Mobile Phone IC

Original price was: ₹1,000.00.Current price is: ₹239.00.

PM 8926 Mobile Phone IC

Powerful Performance in a Compact Package

The PM 8926 Mobile Phone IC is designed to deliver high performance and reliability, making it an essential component for modern smartphones. Crafted with precision, this IC ensures seamless functionality in a variety of mobile applications. PM 8926 Mobile Phone IC

Common Applications

This IC is widely recognized in the mobile repair industry for its presence in:

  • Samsung Devices: Galaxy Grand 2 (G7102, G7105).

     

  • Xiaomi Devices: Early Redmi and Mi 4 series.

     

  • ZTE & Coolpad: Various mid-range LTE smartphones.

Note for Technicians: The PM8926 is a BGA-packaged chip. Replacement requires professional microsoldering tools (Hot Air Station) and precision reballing stencils. If a phone fails to “trigger” current when the power button is pressed, the PM8926 is often the primary suspect.

Engineered for Efficiency

With its efficient power management and advanced design, the PM 8926 not only optimizes your device’s performance but also extends battery life. It’s the perfect solution for maintaining stability in power-sensitive mobile environments. PM 8926 Mobile Phone IC

Wide Compatibility and Durability

The PM 8926 Mobile Phone IC is built to integrate effortlessly with a wide range of mobile devices. Its high durability ensures long-term performance, giving your device the reliability it needs to keep up with daily demands. PM 8926 Mobile Phone IC

The PM8926 is a highly integrated Power Management Integrated Circuit (PMIC) developed by Qualcomm. It is a critical component used primarily in mid-range smartphones (such as the Samsung Galaxy Grand 2 G7102 and various Xiaomi/Coolpad models) to regulate power distribution from the battery to the rest of the device. PM 8926 Mobile Phone IC

Below are the full technical specifications and functional details of the PM8926. PM 8926 Mobile Phone IC


PM8926 Technical Specifications

Feature Details / Specification
Manufacturer Qualcomm Technologies, Inc.
Part Number PM8926
Component Category Power Management IC (PMIC)
Package Type BGA (Ball Grid Array) / WLNSP
Input Voltage Range $1.5\text{V}$ to $5.0\text{V}$ (typical battery range)
Dissipation Power $0.5\text{W}$
Voltage Outputs Multiple (Buck Regulators & LDOs)
Main Output Voltage $1.8\text{V}$ (Logic/System core)
Operating Temperature $-40^\circ\text{C}$ to $+85^\circ\text{C}$ (Industrial Grade)
Storage Temperature $-65^\circ\text{C}$ to $+150^\circ\text{C}$
Application Smartphones, Tablets, IoT Devices
Compatibility Qualcomm Snapdragon MSM8226 / MSM8926 Series

Key Functional Modules

The PM8926 is designed to handle “housekeeping” tasks for a mobile phone. Its architecture includes several specialized modules:

1. Voltage Regulation (Buck and LDO)

The IC contains several Switching Mode Power Supplies (SMPS/Buck) and Low-Dropout Regulators (LDOs). These convert the battery’s fluctuating voltage into steady, lower voltages required by the CPU, RAM, and Modem. It typically supports a “Normal” power mode for performance and a “Retention” mode for low-power standby.

2. Battery & Charging Management

It features a complete charging system that manages the current flow from the USB port to the Li-ion battery. It includes:

  • UVLO (Under-Voltage Lockout): Shuts down the device if the battery drops below a safe threshold (e.g., $3.2\text{V}$).

  • Thermal Protection: Monitors temperature during fast charging to prevent overheating.

     

3. User Interface & Infrastructure

Beyond raw power, the PM8926 controls peripheral functions:

  • LED Drivers: Controls the notification LEDs and keyboard backlighting.

  • Audio Power: Often assists in powering the audio codecs or small speaker amplifiers.

  • RTC (Real-Time Clock): Keeps the time even when the phone is powered off.

4. System Sequencing

The IC is responsible for the Power-On (PON) sequence. When you press the power button, the PM8926 ensures that the processor, memory, and storage are powered up in the correct order to prevent data corruption or hardware failure.


Common Applications

This IC is widely recognized in the mobile repair industry for its presence in:

  • Samsung Devices: Galaxy Grand 2 (G7102, G7105).

     

  • Xiaomi Devices: Early Redmi and Mi 4 series.

     

  • ZTE & Coolpad: Various mid-range LTE smartphones.

Note for Technicians: The PM8926 is a BGA-packaged chip. Replacement requires professional microsoldering tools (Hot Air Station) and precision reballing stencils. If a phone fails to “trigger” current when the power button is pressed, the PM8926 is often the primary suspect.

PM 8926 Mobile Phone IC

More Products https://gaffarmarketdelhi.com

Official Website : https://www.mi.com/in/event/diwali-with-xiaomi/?gad_source=1&gad_campaignid=20258278065&gbraid=0AAAAADgqOSa9QQ1kcS-0O-N8xVXB9KSib&gclid=CjwKCAjwlt7GBhAvEiwAKal0cooIWQHfrFYpsA8dtYy2MRvmAGrXPwl15jU4hyRj-1GzCSCNoihMFhoCmncQAvD_BwE

Weight 0.05 kg
Home
Shop
Wallet
Account
Cart